tag: University of Pennsylvania

Research Bits: April 22
By Jesse Allen - 22 Apr, 2025 - Comments: 0

PIC heterogeneous integration Researchers from Hewlett Packard Labs, Indian Institutes of Technology Madras, Microsoft Research, and University of Michigan built an AI acceleration platform based on heterogeneously integrated photonic ICs. The PIC combines silicon photonics along with III-V compound semiconductors that functionally integrate lasers and optical amplifiers to reduce optical l... » read more

Chip Industry Week In Review
By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Research Bits: Dec. 16
By Jesse Allen - 16 Dec, 2024 - Comments: 0

Soft liquid metal vias Researchers from Virginia Tech and University of Pennsylvania found a way to create soft, flexible electric connections through circuit layers. The method could be used for soft robotics and wearable devices. The technique uses liquid metal microdroplets to create a stair-like structure that forms soft vias and planar interconnects through and across circuit layers wi... » read more

Research Bits: Nov. 25
By Jesse Allen - 25 Nov, 2024 - Comments: 0

3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Chip Industry Week In Review
By The SE Staff - 08 Nov, 2024 - Comments: 0

Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Research Bits: Sept. 9
By Jesse Allen - 09 Sep, 2024 - Comments: 0

All-silicon polarization multiplexer Researchers from the University of Adelaide and Osaka University propose an ultra-wideband integrated terahertz polarization (de)multiplexer implemented on a substrateless silicon base, which they tested in the sub-terahertz J-band (220-330 GHz) for 6G communications. “Our proposed polarization multiplexer will allow multiple data streams to be transmi... » read more

Chip Industry Technical Paper Roundup: May 13
By Linda Christensen - 13 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=225 /] More ReadingTechnical Paper Library home » read more

Materials And Technologies For High Temperature, Resilient Electronics
By Technical Paper Link - 07 May, 2024 - Comments: 0

A technical paper titled “Materials for High Temperature Digital Electronics” was published by researchers at University of Pennsylvania, Air Force Research Laboratory, and Ozark Integrated Circuits. Abstract: "Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportatio... » read more

Research Bits: May 7
By Jesse Allen - 07 May, 2024 - Comments: 0

High-temperature memory Researchers from the University of Pennsylvania and Air Force Research Laboratory demonstrated memory technology capable of enduring temperatures as high as 600° Celsius for more than 60 hours while retaining stability and reliability. The non-volatile memory device consists of a metal–insulator–metal structure, incorporating nickel and platinum electrodes with a 4... » read more

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

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