tag: University of Seoul

Research Bits: Apr. 2
By Jesse Allen - 02 Apr, 2024 - Comments: 0

Stretchy, sensitive circuits Researchers from Stanford University developed skin-like, stretchable integrated circuits capable of driving a micro-LED screen with a refresh rate of 60 Hz and detecting a braille array that is more sensitive than human fingertips. The stretchable transistors are made from semiconducting carbon nanotubes sandwiched between soft elastic electronic materials. The... » read more

Chip Industry’s Technical Paper Roundup: September 26
By Liz Allan - 26 Sep, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=146 /] More Reading Technical Paper Library home » read more

Design Optimization Of Split-Gate NOR Flash For Compute-In-Memory
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “Design Strategies of 40 nm Split-Gate NOR Flash Memory Device for Low-Power Compute-in-Memory Applications” was published by researchers at Seoul National University of Science and Technology and University of Seoul. Abstract: "The existing von Neumann architecture for artificial intelligence (AI) computations suffers from excessive power consumption and memo... » read more

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
By Technical Paper Link - 23 Dec, 2021 - Comments: 0

Abstract "With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and sol... » read more

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