Research Bits: Feb. 4


High-power diamond transistors Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for high-power electronics that remains switched off by default. The performance of the diamond was improved by coating it in hydrogen atoms followed by layers of aluminum oxide. “The challenge for power electronics is that the design of the... » read more

Chip Industry Technical Paper Roundup: Jan. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=400 /] Find all technical papers here. » read more

Chip Industry Week In Review


The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance


A new technical paper titled "Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures" was published by researchers at University of Stuttgart, IIT Kanpur, National Yang Ming Chiao Tung University, Khalifa University, and TU Munich. Abstract "Complementary metal–oxide–semiconductor (CMOS)-based computing promises drastic improvement in performance at extremely low temp... » read more

Chip Industry Week In Review


Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Research Bits: July 30


Embedded thermoelectric devices Researchers from the University of Pittsburgh and Carnegie Mellon University propose using locally embedded thermoelectric devices (TEDs) to perform active cooling inside circuits. “Circuits like clock generators and arithmetic and logic units (ALU) create high-frequency heat fluxes with their peak hot spots occurring on the microprocessor,” said Feng Xio... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Chip Industry’s Technical Paper Roundup: October 24


New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

FeFET Multi-Level Cells For In-Memory Computing In 28nm


A technical paper titled “First demonstration of in-memory computing crossbar using multi-level Cell FeFET” was published by researchers at Robert Bosch, University of Stuttgart, Indian Institute of Technology Kanpur, Fraunhofer IPMS, RPTU Kaiserslautern-Landau, and Technical University of Munich. Abstract: "Advancements in AI led to the emergence of in-memory-computing architectures as a... » read more

Chip Industry’s Technical Paper Roundup: October 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=150 /] Related Reading Technical Paper Library home » read more

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