tag: University of Texas at Austin

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

New Ways To Optimize GEMM-Based Applications Targeting Two Leading AI-Optimized FPGA Architectures
By Technical Paper Link - 07 May, 2024 - Comments: 0

A technical paper titled “Efficient Approaches for GEMM Acceleration on Leading AI-Optimized FPGAs” was published by researchers at The University of Texas at Austin and Arizona State University. Abstract: "FPGAs are a promising platform for accelerating Deep Learning (DL) applications, due to their high performance, low power consumption, and reconfigurability. Recently, the leading FPGA... » read more

Chip Industry Week In Review
By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

Chip Industry’s Technical Paper Roundup: October 31
By Liz Allan - 31 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

Startup Funding: August 2023
By Jesse Allen - 13 Sep, 2023 - Comments: 0

August startup funding continued to follow the trends that put AI and autonomous driving at the top of funding. One of August's largest rounds went to a company designing AI processor IP that can scale from the edge to the cloud. Plus, three battery manufacturers brought in one billion dollars or more. This report covers 37 companies that collectively raised $4.2 billion in August 2023. [... » read more

Week In Review: Design, Low Power
By Susan Rambo - 28 Jul, 2023 - Comments: 0

Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Chip Industry’s Technical Paper Roundup: July 12
By Liz Allan - 12 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

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