Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry’s Technical Paper Roundup: June 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=113 /]   » read more

Search Based Method For Identifying Aging Model Parameters


A technical paper titled “Leveraging Public Information to Fit a Compact Hot Carrier Injection Model to a Target Technology” was published by researchers at University of Victoria. Abstract: "The design of countermeasures against integrated circuit counterfeit recycling requires the ability to simulate aging in CMOS devices. Electronic design automation tools commonly provide this ability... » read more