Manufacturing Bits: Sept. 1

By Mark LaPedus - 01 Sep, 2020 - Comments: 0

AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Food for Thought

By Judy Davies - 10 Dec, 2018 - Comments: 0

Eating healthy, getting plenty of rest and exercising regularly are the main ingredients in the recipe for wellness and fitness. But with today’s hectic lifestyles and hurried pace, do most of us still meet these basic requisites? Over the years, multiple programs have been launched to optimize the nutritional content of the foods we eat. Since the early 1900s, breakfast cereals have been ... » read more

Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2015 - Comments: 0

World’s smallest inkjet image ETH Zurich and Scrona have set the official world’s record for the smallest inkjet-printed color image. The feat, which has been recognized by the Guinness World Records, is based on Scrona’s so-called NanoDrip printing technology and quantum dots. ETH and Scrona printed an image of clown fishes and sea anemones. The printed image measures 0.0092mm² in a... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: USDA

Manufacturing Bits: Sept. 1

Food for Thought

Manufacturing Bits: Dec. 23