Manufacturing Bits: Feb. 21

By Mark LaPedus - 21 Feb, 2017 - Comments: 0

AFM-on-a-chip An atomic force microscope (AFM) is a metrology tool that can measure and characterize structures in three dimensions. It uses a tiny probe to enable measurements in chip structures, but the instrument itself is often a large and bulky system. In response, the University of Texas at Dallas has devised an AFM-on-a-chip technology. The AFM is roughly the size of a dime. Based on... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Manufacturing Bits: Feb. 10

By Mark LaPedus - 10 Feb, 2015 - Comments: 0

Deadweight machines The National Institute of Standards and Technology (NIST) is in the process of cleaning, restoring and recalibrating its 4.45-million Newton deadweight machine. NIST’s deadweight machine, the largest of its kind in the world, is equivalent to one million pounds-force. Built in 1965, the deadweight system consists of a stack of 20 stainless steel discs about three meter... » read more

Manufacturing Bits: Dec. 30

By Mark LaPedus - 30 Dec, 2014 - Comments: 0

Mechanical switches For years, the industry has been talking about the use of advanced mechanical switches in low-power applications. In theory, mechanical switches have zero off-state leakages, abrupt ON/OFF switching capabilities and small voltage swings. Mechanical switches could overcome the energy efficiency limit of CMOS. In fact, mechanical switches could replace CMOS in some applica... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Manufacturing Bits: Feb. 21

The Week In Review: Manufacturing

Manufacturing Bits: Feb. 10

Manufacturing Bits: Dec. 30

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