The Week In Review: IoT

By Jeff Dorsch - 01 Jul, 2016 - Comments: 0

Deals Rambus agreed to acquire the assets of Inphi’s Memory Interconnect Business for $90 million in cash. Under the usual closing conditions, the transaction is scheduled to conclude during the third quarter. The business assets take in customer contracts, intellectual property, product inventory, and supply-chain agreements. “By combining our buffer chip team with the Memory Interconnect... » read more

The Cloud, The IoE, And You

By Ernest Worthman - 13 Nov, 2015 - Comments: 0

In part one, the cloud of the future was dissected. This part examines concerns and possible impediments. No one doubts the cloud will be an important part of the Internet of Everything, but the transition from local to off-site computing will never be completely seamless or risk-free. To begin with, there is the cost of storage and bandwidth. Running applications using on-site hardware ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

Cellular Stranglehold?

By Ann Mutschler - 08 Nov, 2012 - Comments: 0

Do you ever feel like you are completely at the mercy of your cellular service provider? Yeah, me too. Not only did I have to change providers when I relocated, I had to buy a new phone of course. Since my old phone and my new phone were both iPhones, I thought for sure I could use the same car charger….but no dice. This fact has bothered me for quite some time because it made no sense to ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Verizon

The Week In Review: IoT

The Cloud, The IoE, And You

The Week In Review: Manufacturing

Cellular Stranglehold?