The Power Of Visualization

By Hagai Arbel - 27 Aug, 2020 - Comments: 2

In the 1990s, the National Semiconductor Israeli site in Herzliya was responsible for the design and verification of the company’s flagship RISC processor. That was the place and the time when the concept of constraint-random, abstract, coverage-driven verification was born. Engineers realized that without a random generation of stimuli opcodes, it would be very hard to fully verify new pr... » read more

3 Ways To Improve Design Collaboration: Part 2

By Amit Varde - 04 Jun, 2020 - Comments: 0

In the last blog in this series, we talked about how VDD can help design and layout engineers work more efficiently. Communicating precise and accurate information is a key factor in improving productivity, estimates, and the planning process. Visualizing the changes makes it easier to follow the technical details. The ECO (Engineering Change Order) phase is an important phase in the lifecycle... » read more

Bringing a Sharper World In Focus With Virtual UHD Verification

By Mentor, a Siemens Business - 11 May, 2016 - Comments: 0

UHD-4K designs require a verification solution that can handle longer, larger frames, faster frame rates, richer colors, wider contrasts, and highly complex chips. Emulation has the speed, capacity, and performance to churn very quickly through the massive amounts of data and long sequences required for verification. Visualization tools are needed to understand and debug what’s going on in UH... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: visualization

The Power Of Visualization

3 Ways To Improve Design Collaboration: Part 2

Bringing a Sharper World In Focus With Virtual UHD Verification