Taming Corner Explosion In Complex Chips

By Brian Bailey - 23 Feb, 2023 - Comments: 0

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Detecting Electrical Hazards Incurred By Inter-Voltage Domain Crossing In Custom SRAMs

By Hari Sathianathan - 09 Dec, 2020 - Comments: 0

Fast-growing markets, such as 5G, biotechnology, AI, and automotive, are driving a new wave of low-power semiconductor design requirements and, hence, more aggressive low-power management techniques are needed. Consequently, even large macros within a chip, such as SRAMs, now feature multiple voltage domains to limit power draw during light-sleep, deep-sleep, and shutdown-low-power modes. These... » read more

Power’s Impact On Hierarchy Modification

By Ann Mutschler - 16 Jan, 2014 - Comments: 2

RTL restructuring in which the logical hierarchy of a design is modified is usually done to manage complex designs. When power management is added to this task, new challenges crop up. Consider switchable power or voltage domains, which are a common way to manage power is to use switchable power or voltage domains. When implementing this technique, all the logic in such a domain must hang of... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: voltage domains

Taming Corner Explosion In Complex Chips

Detecting Electrical Hazards Incurred By Inter-Voltage Domain Crossing In Custom SRAMs

Power’s Impact On Hierarchy Modification

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