New Design Approaches For Automotive

By Ann Mutschler - 01 Jul, 2021 - Comments: 0

The push toward increasing autonomy in automotive is driving new approaches in electronics development. Instead of designing individual components, the focus now is on modeling in context. The ultimate goal is to create an executable specification based on industry-accepted standards, with enough flexibility to be able to customize that spec for different customers. This is a difficult engin... » read more

Debug: The Schedule Killer

By Brian Bailey - 30 Jun, 2021 - Comments: 0

Debug often has been labeled the curse of management and schedules. It is considered unpredictable and often can happen close to the end of the development cycle, or even after – leading to frantic attempts at work-arounds. And the problem is growing. "Historically, about 40% of time is spent in debug, and that aspect is becoming more complex," says Vijay Chobisa, director of product manag... » read more

Rocky Road To Designing Chips In The Cloud

By Ann Mutschler - 24 Jun, 2021 - Comments: 0

EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

EDA In The Cloud

By Ann Mutschler - 09 Jun, 2021 - Comments: 0

Hagai Arbel, CEO of Vtool, talks with Semiconductor Engineering about the benefits of moving EDA tools to the cloud, why it has been slow to take off, and what will drive this trend in the future. » read more

Invent A New Way To Do Your Job

By Hagai Arbel - 27 May, 2021 - Comments: 0

My friends own a farm in the southwest of France, and though I spent most of my recent decades around big cities, my village-raised roots are sending me working in the fields every time I have the time. I don’t really care what I’m assigned to, as long as soil, the nearby forest trees, and the sky (preferably blue) will take part. If the job consists of repeating actions, I like to come up ... » read more

Hardware-Software Co-verification (ARM CPU)

By Vtool - 26 May, 2021 - Comments: 0

In every complex SoC verification process, it is necessary to activate the CPUs during verification and to check the operation of the software they execute alongside the test’s scenarios. At a minimum, basic scenarios such as “boot rom execution” are tested, but in many cases, further scenarios are required. The CPUs themselves are usually proven IPs, but in order to verify their integrat... » read more

Roadblocks For ML in EDA

By Brian Bailey - 28 Apr, 2021 - Comments: 1

Is EDA a suitable space for utilizing machine learning (ML)? The answer depends on a number of factors, including where exactly it is being applied, how much support there is from the industry, and whether there are demonstrable advantages. Exactly where ML will play a role has yet to be decided. Replacing existing heuristics with machine learning, for example, would require an industry-wide... » read more

The Verification Mindset

By Ann Mutschler - 26 Apr, 2021 - Comments: 2

The practice of semiconductor verification has changed substantially over the years, and will continue to do so. The skillset needed for functional verification 20 years ago is hardly recognizable as a verification skillset today, and the same should be expected moving forward as design and verification becomes more abstract, the boundary of what is implemented in hardware versus firmware and s... » read more

Computing Where Data Resides

By Ann Mutschler - 29 Mar, 2021 - Comments: 3

Computational storage is starting to gain traction as system architects come to grips with the rising performance, energy and latency impacts of moving large amounts of data between processors and hierarchical memory and storage. According to IDC, the global datasphere will grow from 45 zettabytes in 2019 to 175 by 2025. But that data is essentially useless unless it is analyzed or some amou... » read more

Demand for IC Resilience Drives Methodology Changes

By Ann Mutschler - 25 Mar, 2021 - Comments: 0

Applications that demand safety, security, and resilience are driving new ways of thinking about design, verification, and the long-term reliability of chips on a mass scale. The need is growing for chips that can process more data faster, over longer periods of time, and often within a shrinking power budget. That, in turn, is forcing changes at multiple levels, at the architecture, design,... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?