Test Setup Optimization And Automation For Accurate Silicon Photonics Wafer Acceptance Production Tests


Implementing energy-efficient optical transceiver modules with silicon photonics (SiPh) and 3DIC technologies will help alleviate the increasing energy consumption for hyperscale data centers. To facilitate effective 3DIC heterogenous integration of these photonics integrated circuits for optical transceivers, high precision, repeatable and reliable SiPh wafer acceptance tests are essential and... » read more

Heating Up Cryogenic Wafer Testing


The use of on-wafer superconducting materials, other novel materials, and traditional semiconductors at cryogenic temperatures (below about 123K, or -150°C) has grown quickly in recent years. Inventive new sensors take advantage of unique material properties at very low temperatures to detect a wide variety of physical phenomena such as infrared radiation, magnetic fields, x-rays, and more. T... » read more

What’s WAT? Testing At The End Of Manufacturing


The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their area of expertise. On the other hand, the fabless company relies on the expertise and skills of the foundry to produce quality wafers. Many times a process used by a fabless company to manufacture... » read more

Wafer Test Challenges For Chiplets


In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage. From a test perspective, making chiplets a mainstream technology depends on ensuring Good Enough Die at a reasonable test cost. Wafer-level test plays a critical and intricate role in the chipl... » read more

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