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Get Ready For The Next Generation Of Wearable Tech


Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

Six Things We Might Need For Pervasive Computing


There is little doubt that digital technology will become more pervasive than it is even now in the coming decades. Organizations like the Exponential Group argue that digital should be the first step in sustainability, estimating that hardware and software could help reduce emissions by 15% by 2030 and beyond by helping fine-tune buildings, factories, and other environments. Cars—already ... » read more

Power/Performance Bits: Oct. 5


Modeling resistive-switching memory Researchers from Singapore University of Technology and Design (SUTD) and Chang Gung University developed a new toolkit for modeling current in resistive-switching memory devices. The team said that traditional physical-based models need to consider complex behaviors to model current in resistive memory, and there's a risk of permanent device damage due t... » read more

Wearables Disconnect


One of the great opportunities created by the pandemic is a result of conferences going online. I know many people miss the social aspects of not being able to get together with your thousand closest friends, who you see every year at the same shows, but requiring a physical presence is limiting in both time and expense. Personally, I have used the opportunity to "attend" conferences that I wou... » read more

Power/Performance Bits: Sept. 21


Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Will The Fitbit Charge 5 Outshine The Fitbit Luxe?


We don’t know, and we do not comment on whether one device is better than its previous generation. What we do is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5 to arrive, we will take a look at what Fitbit Luxe has inside of it. Fig. 1: Fitbit Luxe. Fig. 2: Fitbit Inspire 2. The Luxe has other changes from the Inspire 2, inc... » read more

System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Challenges With Chiplets And Packaging


Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Power/Performance Bits: Sept. 14


Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

How Chips Will Change Health Care


Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

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