Challenges In Reducing Wireless Latency

By Karen Heyman - 10 Oct, 2024 - Comments: 0

A new and much faster version of Wi-Fi is beginning to infiltrate the IoT market, reducing latency that has begun to creep up as more data is generated, processed, and moved wirelessly from one device to another. An estimated 20 billion connected devices are currently in use. Over the next several years, devices will start to include faster wireless connectivity, enabling more rapid transfer... » read more

Chip Industry Week In Review

By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Wi-Fi 7 Moves Forward, Adding Yet Another Protocol

By Karen Heyman - 17 Jul, 2023 - Comments: 1

The latest generation Wi-Fi protocol brings better speeds and data handling, but it does little to bridge various communications technologies. That, in turn, makes it more difficult and more expensive to design chips because they must integrate and support multiple wireless technologies, including different versions of the same technology. Wireless communications technologies are often victi... » read more

Power Grids Under Attack

By John Koon - 03 Feb, 2022 - Comments: 0

Cyberattacks are becoming as troublesome to the electrical power grid as natural disasters, and the problem is growing worse as these grids become more connected and smarter. Unlike in the past, when a power outage affected just the electricity supplied to homes and businesses, power grids are becoming core elements of smart cities, infrastructure, and safety-related services. Without power,... » read more

Week In Review: Design, Low Power

By Jesse Allen - 07 Jan, 2022 - Comments: 0

SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

Improving Power Efficiency In Ultra-Low Power Designs

By John Koon - 11 Nov, 2021 - Comments: 0

Faster data communications in phones and data centers grabs headlines, but many applications don't require the continuous, high-data-rate communications needed for video streaming or image processing. In fact, for many devices, designing for better performance results in wasted energy and sharply curtails the time between battery charges. That is especially true for machine-to-machine (M2M) ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Jun, 2019 - Comments: 0

Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Where Are The IoT Industry Standards?

By Jeff Dorsch - 10 Oct, 2016 - Comments: 0

Are you ready for some Internet of Things standards? Good, because you can help make them. The IoT is proceeding apace as a business, eagerly embraced by such corporate behemoths as Cisco Systems, General Electric, IBM, and Verizon Communications. What’s lacking is the codification of industry standards for the IoT, as many companies have aligned with groups that have competing agendas and... » read more

802.XX And The IoE

By Ernest Worthman - 03 Sep, 2015 - Comments: 0

Ever since the first 802.11 standard was published in 1997, it has evolved to become the de facto protocol for much of the wireless networking across a wide range of devices and implementations. Today the protocol family includes 802.b 802.11a, 802.11g, 802.11n, and 802.11ac, respectively. Some of these will play a very important role in the IoE. There are other 802.xx protocols (such as 802.15... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?