Battle Brewing Over Automotive Display Protocols

By Bryon Moyer - 06 May, 2021 - Comments: 0

Displays are multiplying in new and future automobiles. That means a lot more display data moving around the vehicle and traveling some distance between sensor and processor. While existing protocols can handle some of the new duties, new protocols also are being developed specifically for this application. “Automotive displays are proliferating, increasing in numbers and in pixel densi... » read more

Self-Driving Cars Rattle Supply Chain

By Ann Mutschler - 06 Apr, 2017 - Comments: 0

Automotive compute workloads are consolidating as carmakers push toward autonomous vehicles, but the changes necessary to make this all work are causing huge disruptions in an industry that has fine-tuned its supply chain over more than a century. Consolidation is essential for a variety of reasons, including efficiency of the computations, complexity management, and lower deployment costs. ... » read more

Systems Engineering Approach To Electrical Wire Interconnection System (EWIS) Development

By Mentor, a Siemens Business - 07 Jul, 2016 - Comments: 0

The development of the Electrical Wire Interconnection System, or EWIS, for today’s advanced aircraft is one of the most complicated engineering activities around. In addition to having to respond to very high rates of change during development, the aircraft are continually evolving in electronic and electrical content through their entire lifecycle. Relatively new mandates, such as the CFR P... » read more

Dealing With New Bottlenecks

By Ed Sperling - 11 Jul, 2013 - Comments: 0

By Ed Sperling While the number of options for improving efficiency and performance in designs continues to increase, the number of challenges in getting chips at advanced process nodes out the door is increasing, too. Thinner wires, routing congestion, more power domains, IP integration and lithography issues are conspiring to make design much more difficult than in the past. So why aren�... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: wiring

Battle Brewing Over Automotive Display Protocols

Self-Driving Cars Rattle Supply Chain

Systems Engineering Approach To Electrical Wire Interconnection System (EWIS) Development

Dealing With New Bottlenecks