Building A Sustainable And Diverse Semiconductor Workforce: Insights From ASMC 2024 Panel Discussion

By Krish Raghunath - 23 Jul, 2024 - Comments: 0

As the semiconductor industry works to attract talent to overcome its labor shortage, governments, educators, and the private sector must collaborate to make industry career opportunities more accessible for prospective employees. This concept provided the framework for a panel discussion during SEMI’s 35th annual Advanced Semiconductor Manufacturing Conference (ASMC) that took place in Alba... » read more

How Quickly Can You Take Your Idea To Chip Design?

By Kira Jones - 16 May, 2024 - Comments: 0

Gone are the days of expensive tapeouts only done by commercial companies. Thanks to Tiny Tapeout, students, hobbyists, and more can design a simple ASIC or PCB design and actually send it to a foundry for a small fraction of the usual cost. Learners from all walks of life can use the resources to learn how to design a chip, without signing an NDA or installing licenses, faster than ever before... » read more

What Is TCAD And Why It Is Essential For The Semiconductor Industry

By Shela Aboud - 16 Nov, 2023 - Comments: 0

Modern technology computer-aided design (TCAD) technologies have been around now for years. Yet, many semiconductor engineers still run experiments directly on wafers to examine chip fabrication processes and device operation. While it can be challenging to become proficient in TCAD, conducting experiments on wafers isn’t exactly easy, nor is it quick or cost-effective to do. As with so ma... » read more

Center For Deep Learning In Electronics Manufacturing: Bringing Deep Learning To Production For Photomask Manufacturing

By Jan Willis - 16 Nov, 2023 - Comments: 0

The Center for Deep Learning in Electronics Manufacturing (CDLe) was formed as an alliance between D2S, Mycronic and NuFlare Technology in autumn 2018. Assignees from each alliance partner worked with deep learning (DL) experts under the leadership of Ajay Baranwal, director of CDLe. The CDLe’s mission was to 1) turn DL into a core competency inside each of the companies and 2) do DL projects... » read more

Transforming Semiconductor Manufacturing: How AI And ML Boost Productivity And Beat The Skill Shortage

By David Park - 16 Nov, 2023 - Comments: 0

In the fast-paced world of semiconductor manufacturing, where innovation and efficiency are essential, there is a serious challenge – the persistent skilled labor shortage. As evident by billboards looking for workers along major highways, this shortage is not just a concern but a pressing reality. Semiconductor manufacturers in the United States face a multifaceted problem—tightened... » read more

Texas: Cybersecurity Workforce Resilience And eCTF Success

By Laurie Giandomenico - 05 Oct, 2023 - Comments: 0

Workforce resilience, the ability to adapt and recover from challenges, is a MITRE Engenuity priority. To ensure a resilient cybersecurity workforce that can defend organizations and the entire nation, we know that future professionals need to be interested in the field. As such, each year we proudly present Embedded Capture the Flag (eCTF), a two-phase competition for students to both test an... » read more

Industry 4.0 Paradigms For Chip Workforce Development And Domestic Production: Using Automation And AR/VR

By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production” was published by researchers at University of Florida Gainesville, ZEISS Microscopy, and US Partnership for Assured Electronics (USPAE). Abstract: "The CHIPS Act is driving the U.S. towards a self-sustainable f... » read more

Being A Design Verification Engineer Is Fun And Rewarding

By Lauranne Choquin - 22 Nov, 2022 - Comments: 0

Philippe Luc, director of verification at Codasip, talked to students of the UK Electronics Skills Foundation (UKESF) about what it is like to be a verification engineer. On one hand the UKESF encourages young people to study electronics and pursue careers in this sector, and on the other hand Codasip is very keen to help prepare the engineers who will solve tomorrow’s technology chall... » read more

Insights From Industry Strategy Symposium Europe 2022

By Cassandra Melvin - 21 Jul, 2022 - Comments: 0

The timely return to an in-person Industry Strategy Symposium (ISS) Europe was welcomed by participants from around the globe on May 30th at the Brussels Sheraton. ISS Europe 2022 featured a new program and event format – with industry insights and strategic topics condensed into one day of programming on three critical challenges facing the microelectronics industry: the energy crisis and su... » read more

The Great Resignation And The Microelectronics Industry: Retaining A Skilled Workforce

By Michelle Williams-Vaden - 17 Mar, 2022 - Comments: 0

"Now hiring" signs are replacing masks and bottles of hand sanitizer as the ubiquitous markers of COVID-19, as the Great Resignation continues, and the Omicron surge ebbs. Everywhere – at fast food restaurants, at top tech companies – there are job openings, offering cash just for showing up at an interview, or up to $100,000 in sign-on bonuses. Consumers across all industries are bein... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.