tag: Yole

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Nov, 2020 - Comments: 0

Chipmakers Earlier this year, the semiconductor industry saw little merger and acquisition activity. More recently, though, there has been a flurry of deals. In July, ADI moved to acquire Maxim. Then, Nvidia announced plans to acquire Arm for $40 billion, followed by AMD’s proposed move to buy Xilinx for $35 billion. Not to be outdone, Marvell has announced plans to buy Inphi. Companies a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jul, 2020 - Comments: 0

Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Oct, 2019 - Comments: 0

Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Sep, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

SiC Market Moves Into Overdrive
By Mark LaPedus - 19 Sep, 2019 - Comments: 0

The silicon carbide (SiC) power semiconductor market continues to heat up in the automotive arena. In recent times, several automotive OEMs have formed a series of alliances with SiC device makers, and for good reason. In a major way, many automotive OEMs are entering or expanding their efforts in the battery-electric car market. SiC power semiconductors are among the key components used ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Aug, 2019 - Comments: 0

Chipmakers In its latest move to cut costs and focus on its core business, GlobalFoundries (GF) has announced plans to jettison its U.S. photomask operations in Burlington, Vt., but the foundry vendor will maintain a stake in its joint venture mask unit. Under the plan, Toppan Photomasks will acquire certain assets of GF’s Burlington photomask facility. “GF is transferring its mask tool... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jun, 2019 - Comments: 0

Market research What’s the CapEx outlook for 2020? Semiconductor capital spending is down in 2019, but the industry faces another slump in 2020, according to IC Insights. The firm sees a 15% decline in CapEx for 2019 with a 5% drop expected in 2020. New 300mm fab construction in Korea is still going strong despite the memory downturn, according to SEMI. “Korea’s fab construction spen... » read more

SiC Demand Growing Faster Than Supply
By Mark LaPedus - 23 May, 2019 - Comments: 2

The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jan, 2019 - Comments: 0

OEMs and chipmakers Apple has reduced its revenue outlook to $84 billion for the quarter, down from $89 billion to $93 billion in its original forecast. The consensus on Wall Street was $91 billion. “The guide down was mostly attributed to weaker-than-expected iPhone demand in emerging markets, predominantly China,” said John Vinh, an analyst with KeyBanc Capital Markets, in a research not... » read more

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