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Inspecting, Testing, And Measuring SiC


Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

Week In Review: Manufacturing, Test


Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Apple has introduced a new MacBook Air, 13-inch MacBook Pro, and Mac mini powered by the M1, the first in a family of chips designed by Apple specifically for the Mac. Based on a 5nm process from TSMC, the M1 is packed with 16 billion transistors, the most Apple has ever put into a chip. It features a CPU core, graphics, AI and other functions all in the same chip. In total... » read more

Week In Review: Manufacturing, Test


Chipmakers Earlier this year, the semiconductor industry saw little merger and acquisition activity. More recently, though, there has been a flurry of deals. In July, ADI moved to acquire Maxim. Then, Nvidia announced plans to acquire Arm for $40 billion, followed by AMD’s proposed move to buy Xilinx for $35 billion. Not to be outdone, Marvell has announced plans to buy Inphi. Companies a... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Week In Review: Manufacturing, Test


Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week In Review: Manufacturing, Test


Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test


Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

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