Solving Problems With The IoT

By John Koon - 02 Feb, 2023 - Comments: 0

The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Security Risks Grow With 5G

By John Koon - 07 Oct, 2021 - Comments: 0

5G mobile phones can download a movie in seconds rather than minutes, but whether that can be done securely remains to be seen. What is clear from technology providers, though, is they are taking security very seriously with this new wireless technology. More data is in motion, and the value of that data is growing as users rely on mobile devices for everything from banking to automotive saf... » read more

Kumu Networks: Full Duplex on One Channel

By Jeff Dorsch - 03 Jan, 2019 - Comments: 0

Kumu Networks is in an enviable position fitting today’s requirements for radio-frequency system designs. The Sunnyvale, Calif., startup, incorporated in 2011 and coming together the following year, has developed self-interference cancellation technology, enabling radios to send and receive signals at the same time on the same channel or on an adjacent channel. This full-duplex technology has... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Apr, 2018 - Comments: 0

Cybersecurity The U.S. and U.K. governments collaborated on an unprecedented message on Monday, together warning that Russian cyberattacks may extend beyond government and private organizations to individual homes and offices. The attacks may focus on Internet of Things devices, said Rob Joyce, the cybersecurity coordinator for the National Security Council, who soon after resigned from the Wh... » read more

Investors Back IoT Startups

By Jeff Dorsch - 07 Mar, 2018 - Comments: 0

Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

Performance Increasingly Tied To I/O

By Ed Sperling - 18 Jan, 2017 - Comments: 0

Speeding up input and output is becoming a cornerstone for improving performance and lowering power in SoCs and ASICs, particularly as scaling processors and adding more cores produce diminishing returns. While processors of all types continue to improve, the rate of improvement is slowing at each new node. Obtaining the expected 30% to 50% boost in performance and lower power no longer can ... » read more

Securing IoE Gateways

By Ernest Worthman - 06 Jul, 2015 - Comments: 0

When we talk about the [getkc id="260" comment="Internet of Everything"], (IoE) we have come to realize that it will really be made up of a lot of different “things. It will envelope everything from home automation to intelligent vehicles, to wearables, to industrial applications, military, infrastructure. The list is almost endless. And there is a lot of discussion about securing these “th... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer