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• Dr. Subhash L. Shinde , Booz Allen, Ex. Univ. of Notre Dame, Ex. Sandia National Labs., Ex. IBM. on The Race To Glass Substrates
• Traian MUNTEAN (Honorary Professor) on A Balanced Approach To Verification
• Amba Prasad on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
• sam on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
• Lentz on Agentic AI In Chip Design
• adam on RISC-V’s Increasing Influence
• Jon Taylor on RISC-V’s Increasing Influence
• Roi Mit on The DAC Valuation
• Janis Robin Schamberger on Chip Industry Week in Review
• Rashid Kukkady on New Data Center Protocols Tackle AI
• Peter Bennet on The DAC Valuation
• Dan Ganousis on Optimizing Data Movement
• DFTguy on Revolutionizing Semiconductor Development With GPU-Enhanced Atomistic Modeling
• 1945x on Laser-Focused Results: Improving EUV Line Edge Roughness With Ion Beam Etching
• Jason Kennerly on Many Options For EUV Photoresists, No Clear Winner
• Marc Swinnen on Development Flows For Chiplets
• Warren Savage on Development Flows For Chiplets
• N. L. Kamaruzzaman on Security Risks Mount For Aerospace, Defense Applications
• IT on Three-Way Race To 3D-ICs
• Marzieh SalarRahimi on Advanced Packaging Fundamentals for Semiconductor Engineers
• Harry Foster on Tape-Out Failures Are The Tip Of The Iceberg
• Brian Bailey on Tape-Out Failures Are The Tip Of The Iceberg
• Purple music on Tape-Out Failures Are The Tip Of The Iceberg
• Messika on Tape-Out Failures Are The Tip Of The Iceberg
• Al on Tape-Out Failures Are The Tip Of The Iceberg
• Svetlana Morozova on GPU Analysis Identifying Performance Bottlenecks That Cause Throughput Plateaus In Large-Batch Inference
• universitywafer on Advancements In Silicon Device Technology And Design Driving New SLM Monitor Categories
• Dr. Dev Gupta on Packaging With Fewer People And Better Results
• Michael Current on Advanced Packaging Fundamentals for Semiconductor Engineers
• Jack G on 3D-IC For The Masses
• Marc Greenberg on Implementing AI Activation Functions
• Dr. D. on Big Changes Ahead For Interposers And Substrates
• Dante on GPU Or ASIC For LLM Scale-Up?
• Gretchen Patti on What Exactly Are Chiplets And Heterogeneous Integration?
• Rob McCance on The Seven Pillars Of IC Package Physical Design
• Lullaby on Times Are Changing For EDA
• RF on Many Options For EUV Photoresists, No Clear Winner
• ETechBuy on Experimental Characterization Results and State-of-the-Art Device-Level Studies of DRAM Read Disturbance
• Fred Chen on Many Options For EUV Photoresists, No Clear Winner
• Chris McMahon (Director FA @ Broadcom) on Failure To Launch
• Alex Martin on Chiplets: A Technology, Not A Market
• Mark Nakamoto on What Exactly Is Multi-Physics?
• Andrew on Lines Blurring Between Supercomputing And HPC
• Jung Yoon on EUV’s Future Looks Even Brighter
• Rishi Bhooshan on Signal Integrity Plays Increasingly Critical Role In Chiplet Design
• Mark Nesselhaus on Non-Traditional Design of Dynamic Logic Gates and Circuits with FDSOI FETs
• Fábio R. Pereira on Digital IC Bring-Up With A Bench-Top Environment
• Schwaja on Chiplets: Where Are We Today?
• Andrew Johnston on Strain, Stress In Advanced Packages Drives New Design Approaches
• Paul Egan on What’s Missing From Predictions
• Dr Dev Gupta on Innovations Driving The Advanced Packaging Roadmap: Part One
• Kevin Cameron on The High But Often Unnecessary Cost Of Coherence
• Riko Radojcic on Strain, Stress In Advanced Packages Drives New Design Approaches
• Raymond Doerr on Navigating Increased Complexity In Advanced Packaging
• Fred Chen on Key Technologies To Extend EUV To 14 Angstroms
• Rob Pearson - RIT on Shortcutting Graduates’ Path To Productivity In Manufacturing And Test
• Fred Chen on Is In-Memory Compute Still Alive?
• Jesse KO on Advanced Packaging Drives Test And Metrology Innovations
• Kumar on Auto Chip Aging Accelerates In Hot Climates
• Dinesh Kumar on Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1
• Ted Wilson on Goal-Driven AI
• Art Scott (Earth ICT, SPC) on Goal-Driven AI
• Santanu on Rethinking Engineering Education In The U.S.
• JOH-POYO on FOPLP Gains Traction in Advanced Semiconductor Packaging
• Dr. Dev Gupta on One Chip Vs. Many Chiplets
• Gregory Johnson on Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
• Theodore Wilson on Shift Left Is The Tip Of The Iceberg
• Sanil Shankar on Is PPA Relevant Today?
• MIHAI BUTA on Managing The Huge Power Demands Of AI Everywhere
• A Duck on Batteries Look Beyond Lithium
• atharva on 2D Semiconductors Make Progress, But So Does Silicon
• Allan Cox on Big Changes Ahead For Analog Design
• S on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• AI Research Scientist on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• Paul Karazuba on A Buyers Guide To An NPU
• Ramesh Sharma on How Die Dimensions Challenge Assembly Processes
• Gan Future on Week In Review: Design, Low Power
• Roseann Johnson on Transitioning To Photonics
• Mohammedd Fahad on A Power-First Approach
• Bhavana Dhene on Promises and Perils of Parallel Test
• Lou Covey on New AI Processors Architectures Balance Speed With Efficiency
• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
• JML on Early STEM Education Key To Growing Future Chip Workforce
• Henley on A Buyers Guide To An NPU
• Joe L on Chip Industry Week in Review
• Graham Allan on GDDR7: The Ideal Memory Solution In AI Inference
• David Weary on Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources
• Russell Klein on Fantastical Creatures
• Erik Jan Marinissen on 3.5D: The Great Compromise
• Vakyu on Fantastical Creatures
• Steve Hayden (Linkedin). on AI/ML’s Role In Design And Test Expands
• Lincoln B on Blog Review: Aug. 7
• Ravi on What’s Next For Emulation
• Laura Peters on Key Technologies To Extend EUV To 14 Angstroms
• Tsumoru Shintake @ OIST on Key Technologies To Extend EUV To 14 Angstroms
• Ev Roach on Will AI Disrupt EDA?
• Dr David Serena on Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
• Jerome Poussin on Navigating the Metrology Maze For GAA FETs
• Sampath on Can AI Write RTL?
• David Leary on Heat-Related Issues Impact Reliability In Advanced IC Designs
• AMA on Using Emulators For Power/Performance Tradeoffs
• Dr. Dev Gupta on Intel Vs. Samsung Vs. TSMC
• Kenny Hatton on Intel Vs. Samsung Vs. TSMC
• Robert N. Blair on Intel Vs. Samsung Vs. TSMC
• MrChippy on Glass Substrates Gain Foothold In Advanced Packages
• Norbert on Enabling 2.5D/3D Multi-Die Package
• Bill Gardner on Big Shift: Creating Automotive SW Without HW
• Ron Lavallee on The Value Of Innovation
• Tarhib IT Limited on Circuit Aging Becoming A Critical Consideration
• Daniel B on U.S. Proposes Restrictions On Tech Investments In China
• Dr Dev Gupta on Controlling Warpage In Advanced Packages
• Tarhib IT Limited on Improving Redistribution Layers for Fan-out Packages And SiPs
• Tarhib IT Limited on Glass Substrates Gain Foothold In Advanced Packages
• Srini Balan on LPDDR Memory Is Key For On-Device AI Performance
• Guru on AI-Powered Data Analytics To Revolutionize The Semiconductor Industry
• Laurent on IC Industry’s Growing Role In Sustainability
• SpeedRazor on Making Chips To Last Their Expected Lifetimes
• Cyrus on What Designers Need To Know About GAA
• equinn on Automotive Electronics Reliability Requires In-Field Silicon Monitoring
• Charles Glaman on The Race To Glass Substrates