Organizations that can succeed in these areas will turn software security from a productivity inhibitor into a business enabler.
DevOps has changed the way organizations bring software to market, allowing them to deliver new applications and features rapidly and continuously. But it’s also introduced new security challenges as testing and remediation have failed to keep pace. As a result, cybercriminals have developed new attack strategies that intensify their focus on the application layer, including open source and software supply chains, capitalizing on the “velocity over security” ethos of modern software development.
A new approach to software development is needed. One that addresses business risk without impeding business progress. One that removes the false choice between speed and security—and makes the promise of DevSecOps a reality.
This eBook details three ways of achieving security with speed.
Organizations that can succeed in these areas will turn software security from a productivity inhibitor into a business enabler and competitive differentiator.
Click here to download.
Steps are being taken to minimize problems, but they will take years to implement.
AMD CTO Mark Papermaster talks about why heterogeneous architectures will be needed to achieve improvements in PPA.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
Number of options is growing, but so is the list of tradeoffs.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Steps are being taken to minimize problems, but they will take years to implement.
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