Transforming AppSec: The Top Three Ways To Build Security Into DevOps

By Synopsys - 03 Aug, 2022 - Comments: 0

DevOps has changed the way organizations bring software to market, allowing them to deliver new applications and features rapidly and continuously. But it’s also introduced new security challenges as testing and remediation have failed to keep pace. As a result, cybercriminals have developed new attack strategies that intensify their focus on the application layer, including open source and s... » read more

2020 CEO Outlook

By Ed Sperling - 25 Jun, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the semiconductor industry's outlook and what's changing with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The conversation was part of the... » read more

Building Security IntoThe DevOps Life Cycle

By Synopsys - 01 Apr, 2020 - Comments: 0

The primary goal when breaking the build in the CI/CD DevOps life cycle is to treat security issues with the same level of importance as quality and business requirements. If quality or security tests fail, the continuous integration server breaks the build. When the build breaks, the CI/CD pipeline also breaks. Based on the reason for the broken build, appropriate activities such as archite... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DEVOps

Transforming AppSec: The Top Three Ways To Build Security Into DevOps

2020 CEO Outlook

Building Security IntoThe DevOps Life Cycle