Bringing the verification and validation platforms together into a single flow to allow re-use of modules and methods greatly improves productivity.
Successful approaches to improve verification productivity are to increase the speed of verification and begin validating software/hardware integration very early in the design process. Historically, verification and validation platforms have been developed as separate flows, preventing reuse of modules and methods between the two. As a consequence, various customized verification and validation platform features must be devised and implemented to verify complex, highly integrated System on Chip (SoC) designs. Bringing these two flows together would save an immense amount of duplicate effort and time while potentially reducing the introduction of errors, since less code needs to be developed and maintained.
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Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Continued expansion in new and existing markets points to massive and sustained growth.
Aging equipment and rising demand are pushing up prices and slowing production.
Experts at the Table: Designing for context, and geopolitical impacts on a global supply chain.
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Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.
Why this is becoming a bigger issue, and what can be done to mitigate the effects.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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