Author's Latest Posts


The Week In Review: Manufacturing


Chipmakers Intel has announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. The fab was announced several years ago, but Intel delayed the plant in 2014. Now, the plant, dubbed Fab 42, is moving forward again. Targeted for 7nm technology, Fab 42 will be completed in 3 to 4 years and will create approximately 3,000 jobs. The announcement was m... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Manufacturing Bits: Feb. 7


The University of California at Santa Barbara claims to have developed the world’s smallest hammer. The technology, dubbed the μHammer or microHammer, is geared for biomedical research. With funding from the National Science Foundation (NSF), the tiny hammer will allow researchers to get a cellular-level understanding when force is applied to brain cells. The project is part of the U.S.-b... » read more

The Week In Review: Manufacturing


Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

Manufacturing Bits: Jan. 31


Fiber-imprint patterning The École polytechnique fédérale de Lausanne (EPFL)--a research institute/university in Lausanne, Switzerland--has put a new twist in nano-imprint patterning technology. It has devised a way to imprint tiny or nano-metric patterns on hollow polymer fiber. Using a technique called thermal drawing, tiny patterns can be printed on both the inside and the outside of ... » read more

The Week In Review: Manufacturing


Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

New Embedded Memories Ahead


The embedded memory market is beginning to heat up, fueled by a new wave of microcontrollers (MCUs) and related chips that will likely require new and more capable nonvolatile memory types. The industry is moving on several different fronts in the embedded memory landscape. On one front, traditional solutions are advancing. On another front, several vendors are positioning the next-generatio... » read more

Manufacturing Bits: Jan. 24


Trapping antimatter Japan’s Riken has conducted measurements in order to discover the differences between matter and antimatter, namely in the complex field of antiprotons. Antimatter is a material composed of antiparticles, according to Wikipedia. Antimatter has the same mass as particles of ordinary matter, but it has an opposite charge, according to Wikipedia. Basically, neutron... » read more

What’s Next For Transistors


The IC industry is moving in several different directions at once. The largest chipmakers continue to march down process nodes with chip scaling, while others are moving towards various advanced packaging schemes. On top of that, post-CMOS devices, neuromorphic chips and quantum computing are all in the works. Semiconductor Engineering sat down to discuss these technologies with Marie Semeri... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

← Older posts Newer posts →