November 2011 - Page 2 of 4 - Semiconductor Engineering

Thinking Bigger
By Kurt Shuler - 17 Nov, 2011 - Comments: 0

I am in Shanghai and Xi’an this week for the ICCAD event and numerous customer visits, and have had the opportunity to observe and reflect upon the drivers of change within our industry. Living in the United States, and specifically Silicon Valley, has given me a front-row seat to the technology business for well over a decade. But my first visit to mainland China has shown me how parochial a... » read more

A Secret Weapon
By Frank Ferro - 17 Nov, 2011 - Comments: 0

By John Bainbridge One of the major advances in SoC design methodologies more than a decade ago was the decoupling of the network-on-chip (NoC) from the individual IP cores throughout the SoC. This was (and is) accomplished through the use of carefully specified sockets such as OCP, the old VSIA VCI and (somewhat later) AMBA-AXI, which establish clear boundaries of communication responsibility... » read more

Dinner Talk
By Jon McDonald - 17 Nov, 2011 - Comments: 0

By Jon McDonald Recently at dinner we were discussing a new video game my son wanted. My wife and I were less than thrilled with the game due to some of the adult themes I had seen in the reviews. As my son was trying to convince us that it was an acceptable game he fell back on the old standard justification: “All my friends are playing it!” This is one of the poorest reasons for anyt... » read more

Buzzwords: Dead or Alive?
By Tiffany Sparks - 17 Nov, 2011 - Comments: 0

By Tiffany Sparks “Time-to-market” and “time-to-volume” – are they overused marketing buzzwords? Until recently, I would have argued yes. After all, it seems like very few solutions in the semiconductor supply chain are not marketed along the lines of addressing time-to-volume or time-to-market challenges. But just because buzzwords become trite, it doesn’t mean they aren’t st... » read more

Mighty Japan Endures as Leader
By Christian Dieseldorff - 16 Nov, 2011 - Comments: 0

By Christian Gregor Dieseldorff After the devastating natural disaster in March, Japan’s semiconductor industry has once again proven that it can overcome disaster and recover quickly. Japan is home to a large number of semiconductor companies and has the largest share of total installed fab capacity. In addition, fabs in Japan lead in cutting-edge technology such as 24nm and 19nm NAND Fla... » read more

Mapping Out The Value Of TLM Modeling
By Frank Schirrmeister - 16 Nov, 2011 - Comments: 1

I have written about the value of system-level design and moving up to next level of abstraction numerous times. This fall one of the most interesting steps of progress towards effective system-level design and emphasis on the importance of embedded software has been made by the two big FPGA vendors Altera and Xilinx. Both vendors have announced devices combining programmable logic of up to sev... » read more

Smart Money in Analog
By Joanne Itow - 16 Nov, 2011 - Comments: 0

By Joanne Itow Recently Semico released a report touting the above average growth rates in the analog market as well as the healthy revenue per wafer for analog products.  Smart money is moving into power management and other analog applications which have gained in popularity in our mobile electronic world. Over the next five years, semiconductor units will grow at a CAGR of 9.6%.  The... » read more

Something Old, Something Borrowed
By Ed Sperling - 11 Nov, 2011 - Comments: 0

The basic rule of SoC design is that it needs to be created relatively quickly, work as planned, and that it can be manufactured at a reasonable cost and with good yield ramp. That eliminates revolutionary changes on the technology side, limits the number of new materials, and relegates the most dramatic shifts to the business. That’s why most of the most far-reaching technology research i... » read more

Experts At The Table: Managing Power At Higher Levels Of Abstraction
By Ed Sperling - 11 Nov, 2011 - Comments: 0

Low-Power Engineering sat down to discuss the advantages of dealing with power at a high level with Mike Meyer, a Cadence fellow; Grant Martin, chief scientist at Tensilica; Vic Kulkarni, senior vice president and general manager at Apache Design; Shawn McCloud, vice president of marketing at Calypto; and Brett Cline, vice president of marketing at sales at Forte Design Systems. What follows ar... » read more

Transdermal patches – a maturing bio imprint application ?
By Michael Watts - 10 Nov, 2011 - Comments: 0

Michael P.C. Watts It looks to me that Kimberly Clark (UK) are targeting the $3B transdermal patch market using imprint technology in a new development program with imprint supplier - Obducat (Sweden). Kimberly-Clark is one of the world’s largest paper companies, who have been acquiring medical companies over the last decade. In my experience, one of the key milestones in the maturation... » read more

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