September 2012 - Page 2 of 6 - Semiconductor Engineering


Where Does It Hurt?


By Ed Sperling The IC design industry is feeling a new kind of pain—this one driven by uncertainty over architectural shifts, new ecosystem interactions and new ways to account for costs. As mainstream ICs move from 50/45/40nm to around 32/28/22nm, there are only two choices for design teams—continue shrinking features or stack dies. In many cases, the ultimate solution may be a combina... » read more

Like Oil And Water


By Ann Steffora Mutschler For years, the promise and allure of a concurrent design methodology included talk of models, high-level synthesis, virtual prototyping and other system-level technologies all peacefully coexisting in a single design methodology. While it sounds like a good idea, the model-based design approach hasn’t mixed well with the virtual prototype approach. And at l... » read more

Measuring RTOS Performance: What? Why? How?


In the world of smart phones and tablet PCs memory might be cheap, but in the more constrained universe of deeply embedded devices, it is still a precious resource. This is one of the many reasons why most 16- and 32-bit embedded designs rely on the services of a scalable real-time operating system (RTOS). An RTOS allows product designers to focus on the added value of their solution while dele... » read more

Technical Considerations For Implementing USB 3.0 On SoCs


The Universal Serial Bus (USB) protocol has been the standard way to connect computers to external devices for nearly two decades. The protocol continues to evolve to support the growing demands of consumer devices. With its simplicity of use, USB is the number one choice of connectivity protocols in the consumer world. USB 3.0 early adoption began in 2010. Now, key USB software and systems pro... » read more

The Good And Bad Of Models


By Ann Steffora Mutschler Driven by fierce competition and the fact that socket decisions are made long before silicon is manufactured, semiconductor companies today ship models and virtual prototypes to their OEMs very early in hopes of locking in the socket. Admittedly, this has been happening for some time, but due to complexity and the need for flexibility of models and virtual platf... » read more

On Design Productivity And Cost of Ownership …


By Frank Schirrmeister Last weekend I spent time with my 7 ½-year-old daughter (the ½ is crucially important at that age) on our tree house project. Well, it is more a tree “deck” so far, which is quite respectable though given that we just started building it in one weekend (as the book I quickly downloaded that evening on the iPad actually recommended). A project like this gives endles... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA


The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

Materials, Architectures And Gordon Moore


Shrinking features on bulk CMOS using planar transistors has turned the semiconductor industry from a startup industry to one of the most efficient and robust industries in the world. Each new process node increases the number of chips that can be cut out of a single wafer, literally defining economies of scale. Gordon Moore defined the direction, which certainly created a long list of chall... » read more

The Sky Isn’t Falling


By Ann Steffora Mutschler 3D ICs add a new dimension to design with new degrees of freedom possible, even with the added design and manufacturing complexities. Looking at the semiconductor ecosystem today and anticipating what will be needed to enable 3D ICs, it is certain that relationships will need to change. What will be required of the players and who will take responsibility for wh... » read more

Quiet, Steady And Sometimes Unexpected Advances For SOI


By Ed Sperling After years of talking about equivalent pricing, technical advantages and consistent processes, silicon on insulator finally appears to be making significant inroads—but not necessarily in ways, places, or even at process nodes where it initially was predicted to gain ground. What’s driving at least some of this change is the semiconductor industry’s progression toward ... » read more

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