June 2014 - Page 3 of 11 - Semiconductor Engineering

Using VDKs For Automotive Systems Development
By Synopsys - 25 Jun, 2014 - Comments: 0

The software content of automotive systems found in powertrain, chassis, safety, body and advanced driver assistance systems (ADAS) application is increasing. At the same time, the pressure to accelerate development time lines, improve reliability and maintain/reduce costs is also increasing. Automotive OEM, Tier 1 and semiconductor companies involved in embedded software development, integrati... » read more

Blog Review: June 25
By Ed Sperling - 25 Jun, 2014 - Comments: 0

Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

System Bits: June 24
By Ann Mutschler - 24 Jun, 2014 - Comments: 0

Experimental 36-core chip The more cores — or processing units — a computer chip has, the bigger the problem of communication between cores becomes. For years, Li-Shiuan Peh, the Singapore Research Professor of Electrical Engineering and Computer Science at MIT, has argued that the massively multicore chips of the future will need to resemble little Internets, where each core has an associ... » read more

Power/Performance Bits: June 24
By Ann Mutschler - 24 Jun, 2014 - Comments: 0

Solar-cell efficiency in one step Rice University scientists have created a single-step process for producing highly efficient materials that let the maximum amount of sunlight reach a solar cell. The Rice lab of chemist Andrew Barron found a simple way to etch nanoscale spikes into silicon that allows more than 99 percent of sunlight to reach the cells’ active elements, where it can be t... » read more

Manufacturing Bits: June 24
By Mark LaPedus - 24 Jun, 2014 - Comments: 0

A cup of sub-wavelength images The National Institute of Standards and Technology (NIST) and the University of Michigan have developed a technology that could enable sub-wavelength images at radio frequencies. Researchers used a mere glass cup, and laser light at optical wavelengths, to measure and image RF fields. In the future, this technology could measure the behavior of metamaterials. ... » read more

Tech Talk: Photonics, Take 2
By Ed Sperling - 23 Jun, 2014 - Comments: 0

Mentor Graphics’ John Ferguson explains why light is getting so much attention for inter-chip communications, where it excels, and why it has limitations. This is the second part in a two-part series. [youtube vid=4-5FbxIpIk4] To view part 1, click here. » read more

Tougher Memory Choices
By Brian Bailey - 23 Jun, 2014 - Comments: 1

In part 1 of this roundtable, the participants talked about the investments being made in memory technologies, the role that memories play in system security and the tools support for optimizing memory architecture. Taking part in the conversation are Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technolog... » read more

The Week In Review: Design
By Ed Sperling - 20 Jun, 2014 - Comments: 0

M&A Cadence completed its acquisition of Jasper Design Automation, using cash and revolving credit to finance the deal. It will explain the impact on 2014 financial results in fiscal 2015. Jasper’s team, led by CEO Kathryn Kranen, will now report to Cadence senior VP Charlie Huang in Cadence’s System & Verification Group. The deal was first announced in April. Tools Coverity un... » read more

More Simplicity Next Year
By Anne Cirkel - 20 Jun, 2014 - Comments: 0

I briefly mentioned last week that I want to give you a glimpse behind the curtain of the DAC operation during the year. One goal of this blog is to give you some insight into the work the fabulous volunteers for DAC are doing. And that’s not only the 20 volunteers on the DAC Executive Committee. From the technical program committees all the way to the marketing committee, the event is entire... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jun, 2014 - Comments: 0

According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

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