December 2014 - Page 4 of 11 - Semiconductor Engineering

From Specification To Chip: A Holistic Design Approach
By Kalpesh Sanghvi - 18 Dec, 2014 - Comments: 0

Chip design is getting more and more challenging in terms of power, performance, area and IP integration. At the same time, competition and time-to-market are forcing much tighter schedules. The traditional ASIC design approach taken by OEMs is to handle the majority of front-end design in-house, and then hand off either register-transfer level (RTL) code or a netlist to an outside vendor, who ... » read more

High-Performance Network Data-Packet Classification Using Embedded Content-Addressable Memory (TCAMs)
By eSilicon - 17 Dec, 2014 - Comments: 0

With port speeds exceeding 100Gbps, route lookups that are fundamental to all routers have relied on ternary content addressable memories (TCAMs) to provide a lookup response within a clock cycle. However, TCAMs in discrete form are expensive, consume a lot of power, compete for precious real estate on the printed circuit board (PCB), and in some applications lack required flexibility. Embeddin... » read more

Using VDKs For Automotive Systems Development
By Synopsys - 17 Dec, 2014 - Comments: 0

The software content of automotive systems found in powertrain, chassis, safety, body and advanced driver assistance systems (ADAS) application is increasing. At the same time, the pressure to accelerate development time lines, improve reliability and maintain/reduce costs is also increasing. Automotive OEM, Tier 1 and semiconductor companies involved in embedded software development, integrati... » read more

FPGA Verification with Assertions: Why Bother?
By Mentor, a Siemens Business - 17 Dec, 2014 - Comments: 0

This paper provides a practical, easy, step-by- step set of instructions on how to add assertions to your RTL design. By following the simple guidelines provided in this paper you will benefit by cutting simulation debugging time in half, as well as finding very complex bugs that are likely to escape traditional simulation without assertions. To read more, click here. » read more

Blog Review: Dec. 17
By Ed Sperling - 17 Dec, 2014 - Comments: 0

Ansys' Bill Vandermark unearths the top five engineering articles for this week. Check out the ship-based laser weapon used to destroy drones. There's also a product called The Sphere that allows you to do strange things like answer the phone by tapping on the refrigerator. Bet you didn't think of that one. Cadence's Steve Carlson lists the top five things that can go wrong in mixed signal ... » read more

Enabling ISO 26262 Qualification
By Cadence - 17 Dec, 2014 - Comments: 0

This document describes how to approach the software tool qualification outlined in ISO 26262 when developing automotive electrical and electronic systems using Cadence tools. Cadence provides an ISO 26262 Tool Qualification Kit, also described in this document, that can help developers through the process with common use cases and reference workflows. Following these guidelines speeds developm... » read more

Chip Business Picks Up In Japan
By Kenji Tsuda - 16 Dec, 2014 - Comments: 0

Japan's semiconductor business is showing signs of recovery after several years of slumping sales due to an overall market recovery, the favorable exchange rate for the yen, and ongoing business restructuring. Consider Renesas, for example. The company went through several downsizing phases, causing a decline in semiconductor sales by 3.9% to 199.6 billion yen ($1.69 billion) in its fiscal Q... » read more

Power/Performance Bits: Dec. 16
By Ann Mutschler - 16 Dec, 2014 - Comments: 0

Measuring electrons in silicon In what is believed to be a first, a team of physicists and chemists based at UC Berkeley, Ludwig-Maximilians Universität in Munich, Germany, the University of Tsukuba, Japan, and the Molecular Foundry at the Department of Energy’s Lawrence Berkeley National Laboratory has captured images of electrons breaking free of their atomic shells using attosecond pulse... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2014 - Comments: 0

Space DSA NASA's Physical Science Research Program is taking directed self-assembly (DSA) technology to new heights. On the International Space Station, astronauts are exploring the development of nanoparticles suspended in magnetorheolocial (MR) fluids. MR fluids, which are a new class of smart materials, self-assemble into shapes in the presence of a magnetic field. With the technology, r... » read more

System Bits: Dec. 16
By Ann Mutschler - 16 Dec, 2014 - Comments: 0

High rise chip For decades, the mantra of the semiconductor industry has been ‘smaller, faster, cheaper.’ Stanford researchers are also adding ‘taller’ to the mix, and describing how to build high-rise chips that promise to leapfrog the performance of the single-story logic and memory chips on today's circuit cards. Stanford researchers said their approach would end the ‘logjams�... » read more

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