May 2015 - Page 3 of 11 - Semiconductor Engineering

Automating Root-Cause Analysis To Reduce Time To Find Bugs by Up To 50%
By Cadence - 27 May, 2015 - Comments: 0

If you’re spending more than 50% of your verification effort in debug, you’re not alone. For many design, verification, and embedded software engineers as well as engineers verifying complex standard protocols, debug is the primary bottleneck in verification. Most debug today is completed using the traditional methodology of print statements paired with waveforms. Given that today’s desig... » read more

Blog Review: May 27
By Jesse Allen - 27 May, 2015 - Comments: 0

With the launch of UNICEF and ARM's 'Wearables for Good' design challenge, David Maidment digs into the program's details and how unobtrusive wearables and sensor technology benefits not only consumers in affluent countries, but could improve conditions for those in the developing world as well. From an ultracompact beamsplitter that could boost processing power for supercomputers within the... » read more

Demystifying the HDCP2.2 Authentication Process
By Synopsys - 27 May, 2015 - Comments: 0

This paper explains HDCP2.2 which is the latest generation content protection protocol. Our primary focus here is to explain how the authentication process on HDCP2.2, the various steps that are necessary in able to validate the receiver. The encryption on the keys in version 2.2 is more advanced than previous versions (HDCP1.X), which basically makes it harder to break. HDCP 2.2 is required fo... » read more

Tortuga Logic: Hardware Security
By Ed Sperling - 26 May, 2015 - Comments: 0

For the Internet of Things to really get rolling, it has to be bulletproof. And given the number of very high-profile security breaches in recent months, it has a long way to go before consumers or businesses will feel comfortable using any of a new wave of smart devices That concern has prompted a wave of acquisitions from companies such as Intel (McAffee), Cadence (Jasper Design Automation... » read more

System Bits: May 26
By Ann Mutschler - 26 May, 2015 - Comments: 0

Microfluidic cell-squeezing MIT researchers have shown it is possible to use a microfluidic cell-squeezing device to introduce specific antigens inside the immune system’s B cells, providing a new approach to developing and implementing antigen-presenting cell vaccines. These types of vaccines are created by reprogramming a patient’s own immune cells to fight invaders, and are believed ... » read more

Power/Performance Bits: May 26
By Jesse Allen - 26 May, 2015 - Comments: 0

Woven fabric electrodes An international team including scientists from the University of Exeter pioneered a new technique to embed transparent, flexible graphene electrodes into fibers commonly associated with the textile industry. Exeter Professor Monica Craciun, co-author of the research said: "This is a pivotal point in the future of wearable electronic devices. The potential has been... » read more

Manufacturing Bits: May 26
By Mark LaPedus - 26 May, 2015 - Comments: 0

Table-top EUV Swinburne University of Technology has developed a table-top extreme ultraviolet (EUV) laser power source. The source could be used to develop a system for use in metrology and other applications. The table-top setup is a new way to generate bright beams of coherent EUV radiation. It may offer a cost-effective alternative to large-scale facilities, such as synchrotrons or free... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 May, 2015 - Comments: 0

At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

The Week In Review: Design/IoT
By Jesse Allen - 22 May, 2015 - Comments: 0

Tools Cadence updated its Allegro PCB product line with a new manufacturing option that accelerates manufacturing documentation and technology updates for increased efficiency, control and productivity for designers and streamlining handoff to manufacturing. The release also allows users to develop custom fabrication and assembly rules. Invionics expanded its Invio EDA development platfor... » read more

Book-To-Bill Ratio Strengthens
By Ed Sperling - 22 May, 2015 - Comments: 0

The book-to-bill ratio, which is a measure of orders received versus product billed, was positive for the first four months of the year, a sign that equipment sales are up as foundries prepare for manufacturing at advanced nodes and for the IoT. The three-month moving average for bookings was $1.57 billion in April for North America alone, which is up 9% year over year from $1.44 billion. Th... » read more

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