January 2016 - Page 9 of 10 - Semiconductor Engineering

Keeping The Lights On
By Brian Derrick - 07 Jan, 2016 - Comments: 0

IoT is comprised of numerous industries. For the sake of analysis, these can be segmented into several tiers that function as independent networks or integrated complicated meshes. In my November post I examined the three-tier IoT architecture at a high level. Then last month I focused on the rapidly expanding market of intelligent gateways. Gateways receive information from cloud applicatio... » read more

Securing Modern-day Devices With Embedded Virtualization And ARM TrustZone Technology
By Mentor, a Siemens Business - 07 Jan, 2016 - Comments: 0

When securing today’s modern devices, it’s not enough to know the type of device you want to secure. Equally important is the process used to develop that device. In this paper, we’ll take a closer look at security as it relates to protecting data, building security into a device, and securing SoCs in multicore architectures. ARM TrustZone technology, which provides a solution for carving... » read more

Interference In The Car
By Ernest Worthman - 07 Jan, 2016 - Comments: 0

Once again, a paradigm shift is upon us. Mobile connectivity has radically changed the automobile’s place in the world of connected everything. And that paradigm will shift even further once the IoE is in full bloom. As all of this unfolds and technology marches on, some see the connectivity of the automobile as being a better and more powerful alternative to the smartphone. It is touted a... » read more

EDA, IP Numbers Strong
By Ed Sperling - 06 Jan, 2016 - Comments: 0

EDA and IP sales were 7.1% in Q3 across all major segments and all geographical regions, increasing to $1.957 billion compared with $1.828 billion in the same period in 2014, according to just-released numbers from the EDA Consortium. The four-quarter moving average was up 8.8%. "This was an excellent quarter for EDA," said Wally Rhines, board sponsor for the EDA Consortium's Market Statisti... » read more

Smarter Cities
By Ernest Worthman - 06 Jan, 2016 - Comments: 0

One of the benefits touted by IoE proponents is that smart cities will improve the quality of life and make cities more “livable.” The concept is appealing, and if it comes to pass as visionaries hope, the smart city of the future will be a virtual cornucopia of convenience and efficiency. Residents and vistors will never be lost with the proliferation of location technologies, which als... » read more

Blog Review: Jan. 6
By Jesse Allen - 06 Jan, 2016 - Comments: 0

Mobile is not just about handsets, but also cloud datacenters and the networking to move data back and forth. Cadence's Paul McLellan takes a look at the future of traditional dataservers with the rise of microservers and the use of FPGA accelerators. Mentor's Jay Gorajia has ideas for how to best leverage manufacturing analytics, but says that care must be taken in deciding which data shoul... » read more

Verification Grows Up
By Brian Bailey - 05 Jan, 2016 - Comments: 2

Semiconductor Engineering sat down with a group of verification experts to see how much progress has been made in solving issues associated with the profession. Panelists included Mike Baird, President of Willamette HDL; Jin Zhang, VP marketing and customer relations for [getentity id="22147" comment="Oski Technology"] and Lauro Rizzatti, a marketing consultant and previously the general manage... » read more

System Bits: Jan. 5
By Ann Mutschler - 05 Jan, 2016 - Comments: 0

Faster quantum dot entanglement Due to entanglement between distant quantum objects being an important ingredient for future information technologies, ETH Zurich researchers have developed a method with which such states can be created a thousand times faster than before. [caption id="attachment_24629" align="alignright" width="300"] In two entangled quantum objects the spins are in a super... » read more

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2016 - Comments: 0

New materials for 3D printing HRL Laboratories has developed a new ceramic technology for 3D printing. The technology overcomes the limits of traditional ceramic processing, thereby enabling high-strength components. Ceramics are much more difficult to process than traditional 3D printing materials, such as polymers or metals, according to HRL, a corporate R&D laboratory owned by The Boeing... » read more

Power/Performance Bits: Jan. 5
By Jesse Allen - 05 Jan, 2016 - Comments: 0

A foggy consortium Scientists at Princeton University, ARM, Cisco, Dell, Intel, and Microsoft formed a global effort to develop architectures and tools to further "fog computing" and networks, which aim to harness connected devices' own computing, sensing and storage power to form edge networks that meet most of the demand of user devices that are at the periphery of a more centralized netwo... » read more

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