Why the centralization of processing is reaching its limit, and what comes next.
The past decade has seen massive growth in centralized computing, with data processing flowing to the cloud to take advantage of low-cost dedicated data centers. It was a trend that seemed at odds with the general trend in computing — a trend that started with the mainframe but moved progressively towards ambient intelligence and the internet of things (IoT). As we move into 2018, this centralization is reaching its limit. The volume of data that will be needed to drive the next wave of applications is beginning to force a change in direction.
Currently, just 10% of enterprise-generated data is created and processed outside centralized data centers. Industry analyst Gartner predicts this figure will reach 50% by 2022. This necessary reversal is driven by the shift towards hyper-connected cyber-physical systems, enabled by the arrival of technologies such as 5G wireless communications and a new wave of application-focused computing hardware.
To read more, click here.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Four industry experts talk about what’s changing, how quickly, and where the limits are with AI.
Work begins on building a quantum computing ecosystem.
2019 will be a year of change for the semiconductor industry as new fields drive technological advancements.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Access to source code makes it attractive for custom applications, but gaps remain in the tool flow and in software.
Technology adds more granularity, but starting point for design shifts as architectures cope with greater volumes of data.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply