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Evaluation of Thermal Imaging on Embedded GPU Platforms for Application in Vehicular Assistance Systems


Abstract "This study is focused on evaluating the real-time performance of thermal object detection for smart and safe vehicular systems by deploying the trained networks on GPU & single-board EDGE-GPU computing platforms for onboard automotive sensor suite testing. A novel large-scale thermal dataset comprising of > 35,000 distinct frames is acquired, processed, and open-sourced in challengin... » read more

How Inferencing Differs From Training in Machine Learning Applications


Machine learning (ML)-based approaches to system development employ a fundamentally different style of programming than historically used in computer science. This approach uses example data to train a model to enable the machine to learn how to perform a task. ML training is highly iterative with each new piece of training data generating trillions of operations. The iterative nature of the tr... » read more

Manufacturing Shifts To AI Of Things


AI is being infused into the Internet of Things, setting the stage for significant improvements in manufacturing productivity, improved uptime, and reduced costs — regardless of market segment. The traditional approach to improving manufacturing equipment reliability and efficiency is regular scheduled maintenance. While that is an improvement over just fixing or replacing equipment when i... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022


Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Next Steps For Panel-Level Packaging


Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Enablers And Barriers For Connecting Diverse Data


More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

HBM3: Big Impact On Chip Design


An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

The Everything New Syndrome


Technology is all about the latest features, the fastest processing, with the lowest power. While that sounds great in marketing pitch, any or all of those factors don't necessarily equate to a better product or long-term user satisfaction. There's a reason semiconductor companies are conservative by nature. They want to know that when they spend tens or hundreds of millions of dollars on a ... » read more

Tradeoffs Between Edge Vs. Cloud


Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

Edge Computing: New Support For Digital Twins


Digital twins are one of the most exciting technology developments to emerge over the past few years. By creating a virtual model of a physical product, then simulating its real-time operation, companies are optimizing maintenance, predicting critical maintenance events and fueling innovation via actual performance feedback. Because simulation requires computational resources and the associated... » read more

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