May 2018 - Page 3 of 12 - Semiconductor Engineering

First Look At USB 3.2
By Eric Huang - 24 May, 2018 - Comments: 0

I’m super excited to write about and show to you the world’s first USB 3.2 demonstration. Go watch the video first and then read the rest. https://youtu.be/WPUvHeq_Sgs USB 3.2 hardware and software setup We implemented our USB 3.2 Device and Host in the HAPS-80 FPGA-Based hardware prototyping platform. The platforms use USB PHYs, which are implemented in a FinFET process node. ... » read more

Speeding Up High-Frequency Trading
By Sunil Sahoo - 24 May, 2018 - Comments: 0

The High-Frequency Trading (HFT) industry has received a lot of attention during the last few years. HFT is all about speed and minimizing latency: the faster you can run trading strategies and algorithms for analyzing minute price changes and executing trade orders, the higher the probability to win over competition. So the competition in this area is very fierce with market players continuous... » read more

Tech Talk: Traceability In Functional Safety
By Ed Sperling - 24 May, 2018 - Comments: 0

Dominik Strasser, vice president of engineering at OneSpin Solutions, talks about the impact of functional safety regulations on liability and traceability in automotive, rail, industrial, nuclear and machinery applications. https://youtu.be/2jWnId8jQJg » read more

CEO Outlook On Chip Industry (Part 1)
By Ed Sperling - 24 May, 2018 - Comments: 1

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

Choosing A Format For The Portable Stimulus Specification
By Mentor, a Siemens Business - 23 May, 2018 - Comments: 0

The Accellera Systems Initiative is currently defining a Portable Stimulus Specification (PSS) standard for verification models that can be used to generate appropriate tests for all levels and platforms automatically. The current draft of the standard includes two alternative input formats for these models. This paper examines the merits and challenges of both formats. To read more, click h... » read more

Measuring And Analyzing SoC Performance With Verdi Performance Analyzer
By Synopsys - 23 May, 2018 - Comments: 0

SoC performance is a key competitive advantage in the marketplace. The choice and configuration of SoC components—protocol IP and interconnects, is geared towards maximizing overall SoC performance. A case in point is the use of HBM (High Bandwidth Memory) technology and controllers. Currently in its third generation, HBM boasts high-performance while using less power in a substantially small... » read more

Quantum Effects At 7/5nm And Beyond
By Ed Sperling - 23 May, 2018 - Comments: 5

Quantum effects are becoming more pronounced at the most advanced nodes, causing unusual and sometimes unexpected changes in how electronic devices and signals behave. Quantum effects typically occur well behind the curtain for most of the chip industry, baked into a set of design rules developed from foundry data that most companies never see. This explains why foundries and manufacturing e... » read more

Backchannel Modeling And Simulation Using Recent Enhancements To The IBIS Standard
By Cadence - 23 May, 2018 - Comments: 0

Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBIS-AMI models to emulate this real-world SerDes behavior. AMI modelers now can incorporate backchannel algorithms into their IBIS-AMI models, automating the optimization of transmitter and receiver equalization settings in the same manner as their actual SerDes hardware devices. This saves system desi... » read more

Cure The Common Cold…
By Brian Fuller - 23 May, 2018 - Comments: 0

The technology sector has no equal in the ability of its people to visualize what might be possible and then make it happen fast. If we were sorting out the common cold, the sniffles may already have been relegated to the past. Maybe that’s a claim too far but while imagining the future has always been a feature of our world I think we’ve gone into overdrive in the last few years. From a... » read more

EDA In The Cloud (Part 3)
By Brian Bailey - 23 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

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