Alternative Text

Jesse Allen

  (all posts)
Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Blog Review: October 11
By Jesse Allen - 11 Oct, 2023 - Comments: 0

Cadence's Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination. Synopsys' Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators. Siemens' Kevin Webb expla... » read more

Startup Funding: September 2023
By Jesse Allen - 09 Oct, 2023 - Comments: 0

Chip-to-chip and data center I/O drew investor interest in September, including support for several startups developing Compute Express Link (CXL) solutions. Elsewhere in the data center, several large rounds went to companies developing AI accelerators. And at the edge, startups are building unique ways to handle AI at very little power by initially processing data directly at the sensor. O... » read more

Blog Review: October 4
By Jesse Allen - 04 Oct, 2023 - Comments: 0

Cadence's Felipe Goncalves checks out the Integrity and Data Encryption (IDE) feature in PCIe 6.0, a new layer inserted between the transection layer and data link layer with the goal of protecting against threats from physical attacks on the link. Siemens' Robin Bornoff, Daniel Berger, and Kai Liu explore the potential for large language models (LLMs) make the use of CAE tools simpler, more... » read more

Research Bits: October 3
By Jesse Allen - 03 Oct, 2023 - Comments: 0

Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

Blog Review: September 27
By Jesse Allen - 27 Sep, 2023 - Comments: 0

Siemens' Dirk Hartmann examines how a continual improvement in predictive capability processing and algorithms enables the evolution of simulation performance and highlights two areas that underpin most simulation tools. Synopsys' Ian Land, Jason Niatas, and Marc Serughetti note that digital twins can be used from the chip level through sub-systems and up to the system level to examine perfo... » read more

Research Bits: September 26
By Jesse Allen - 26 Sep, 2023 - Comments: 0

2D waveguides Researchers from the University of Chicago found that a sheet of glass crystal just a few atoms thick could trap and carry light efficiently up to a centimeter. In tests, the researchers found they could use extremely tiny prisms, lenses, and switches to guide the path of the light along a chip. “We were utterly surprised by how powerful this super-thin crystal is; not on... » read more

Blog Review: September 20
By Jesse Allen - 20 Sep, 2023 - Comments: 0

Siemens' Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed. Synopsys' Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together. Cadence's V... » read more

Research Bits: September 19
By Jesse Allen - 19 Sep, 2023 - Comments: 0

Measuring lithography plasma sources Researchers from the University of Twente developed a tool that can measure the size of a plasma source and the color of the light it emits simultaneously, which they say could be used to improve lithography machines. “Traditionally, we could only look at the amount of light produced, but to further improve the chipmaking process, we also want to study... » read more

Blog Review: September 13
By Jesse Allen - 13 Sep, 2023 - Comments: 0

Siemens' Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem. Synopsys' Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center shou... » read more

Startup Funding: August 2023
By Jesse Allen - 13 Sep, 2023 - Comments: 0

August startup funding continued to follow the trends that put AI and autonomous driving at the top of funding. One of August's largest rounds went to a company designing AI processor IP that can scale from the edge to the cloud. Plus, three battery manufacturers brought in one billion dollars or more. This report covers 37 companies that collectively raised $4.2 billion in August 2023. [... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy