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Week In Review: Design, Low Power


Alphawave IP will acquire the OpenFive business unit from SiFive. The $210 million cash deal will bring OpenFive’s high-speed connectivity SoC IP portfolio to Alphawave and nearly double its IPs currently available, including an expanded die-to-die connectivity portfolio as well as adding data center and networking custom silicon solutions. "When we completed our IPO in 2021, we committed to ... » read more

Blog Review: March 16


Ansys' Peter Hallschmid and Sandra Gely look at why, compared to rain and fog, snow is a different challenging environment for automotive sensors and how the random pattern of snowfall, properties of each flake, and the various distance between flakes play havoc on detecting objects. Siemens' Chuck Battikha focuses on how to protect against random hardware faults, the added costs of includin... » read more

Research Bits: March 15


Interferometer on chip Researchers at the University of Rochester developed an optical interferometer on a 2mm by 2mm integrated photonic chip that is capable of amplifying interferometric signals without a corresponding increase in extraneous noise. Interferometers merge two or more sources of light to create interference patterns that provide information able what they illuminate. “If y... » read more

Week In Review: Design, Low Power


Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

Blog Review: March 9


Arm's Ajay Joshi investigates how to select the right benchmark for CPUs used in the Home device market, such as digital television and set-top box/over-the-top devices. Ansys' Jon Kordell checks out how reliability physics simulations and physical component characterization can support component swapping in high-reliability applications when the original part is unavailable due to supply ch... » read more

Startup Funding: February 2022


Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more

Research Bits: March 7


Optical signal processing with acoustic waves Researchers from Pohang University of Science & Technology (POSTECH) demonstrated an optical-wave signal that can be amplified or canceled using optically driven acoustic waves on a silicon chip. Optical signal processing using Brillouin scattering, in which acoustic waves scatter light, has been demonstrated in nanophotonic structures. But ... » read more

Week In Review: Design, Low Power


Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Blog Review: March 2


Arm's Charlotte Christopherson checks out SpiNNaker1, a project to develop a massively parallel, manycore supercomputer architecture that mimicked the interactions of biological neurons, and its follow up, SpiNNaker2, a hybrid system that combines statistical AI and neuromorphic computing. Cadence's Paul McLellan looks at open and generic PDKs that can be used by researchers and in education... » read more

Research Bits: March 1


Large-scale phased array Researchers at Princeton University developed a large-scale high-frequency antenna array using thin-film materials. “To achieve these large dimensions, people have tried discrete integration of hundreds of little microchips. But that’s not practical — it’s not low-cost, it’s not reliable, it’s not scalable on a wireless systems level,” said senior stud... » read more

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