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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Research Bits: July 18
By Jesse Allen - 18 Jul, 2022 - Comments: 0

CXL memory disaggregation Researchers from the Korea Advanced Institute of Science and Technology (KAIST) developed a Compute Express Link (CXL) solution for directly accessible, high-performance memory disaggregation that they say significantly improves performance compared to existing remote direct memory access (RDMA)-based memory disaggregation. RDMA enables a host to directly access an... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Jul, 2022 - Comments: 0

Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

Blog Review: July 13
By Jesse Allen - 13 Jul, 2022 - Comments: 0

Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

Research Bits: July 11
By Jesse Allen - 11 Jul, 2022 - Comments: 0

Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Jul, 2022 - Comments: 0

Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

Blog Review: July 6
By Jesse Allen - 06 Jul, 2022 - Comments: 0

Synopsys' Mike Gianfagna looks at how the data center paradigm has shifted in the last ten years with an exponential increase in the amount of data demanding new approaches to storage that rely on distributed networks. Cadence's Frank Schirrmeister explains multidisciplinary design analysis and optimization, or MDAO, and how it is being combined with machine learning models to enhance classi... » read more

Startup Funding: June 2022
By Jesse Allen - 06 Jul, 2022 - Comments: 0

Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Jul, 2022 - Comments: 0

IP, design Arm unveiled a number of new CPUs and GPUs. Based on the Armv9 architecture, the Cortex-X3 aims to improve single-threaded performance and targets a range of benchmarks and applications. The Cortex-A715 focuses on efficient performance, delivering a 20% energy efficiency gain and 5% performance uplift compared to Cortex-A710. In addition, the Cortex-A510 and DSU-110 were updated to ... » read more

Blog Review: June 29
By Jesse Allen - 29 Jun, 2022 - Comments: 0

Synopsys' Emilie Viasnoff argues that optical sensors are critical building blocks of autonomous vehicles and that sensor digital twins have the potential to dramatically reduce the amount of field testing needed by using driving simulators for tasks ranging from design and testing to integration and autonomous driving system co-optimization. Siemens' Sumit Vishwakarma considers the evolutio... » read more

Power/Performance Bits: June 28
By Jesse Allen - 28 Jun, 2022 - Comments: 0

Making uniform wafers Scientists from the Korea Institute of Machinery & Materials (KIMM) and Nanyang Technological University Singapore (NTU Singapore) propose a technique that combines nanotransfer printing with metal-assisted chemical etching to improve wafer uniformity and increase yield. The researchers used a chemical-free nanotransfer printing technique that transfers gold nanost... » read more

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