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Week In Review: Design, Low Power


Tools & IP Codasip debuted two new customizable low power embedded RISC-V processor cores. To support embedded AI applications, the L31/L11 cores run Google’s TensorFlowLite for Microcontrollers. Codasip Studio tools can be used to customize for specific system, software, and application requirements. Licensing the CodAL description of a Codasip RISC-V core grants customers a full archit... » read more

Blog Review: Feb. 23


Synopsys' Varun Agrawal looks at four new technologies have emerged to support the demands on 5G networks and applications, the challenges in validating all of those technologies together, and what's needed to perform end-to-end testing effectively for 5G O-RAN SoCs. Siemens EDA's Ray Salemi points to how FPGA retargeting could help address supply chain difficulties and some of the challenge... » read more

Research Bits: Feb. 22


Dense optical data storage Researchers from the University of Southampton developed a laser writing method for producing high-density nanostructures in silica glass, which could be used for long-term, dense data storage. “Individuals and organizations are generating ever-larger datasets, creating the desperate need for more efficient forms of data storage with a high capacity, low energy ... » read more

Week In Review: Design, Low Power


AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Blog Review: Feb. 16


Arm's Mark Nicholson explains the software side of the Morello project to implement a prototype security-focused architecture, presenting a high-level view of the software stacks and discussing the status and roadmap of a range of activities. Synopsys' Ron Lowman finds that as IoT technology and capabilities of portable devices expand, the deployment of 5G networks and interest in AI and aut... » read more

Power/Performance Bits: Feb. 15


3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Week In Review: Design, Low Power


Nvidia's proposed acquisition of Arm is officially off. The deal faced significant pushback from regulatory agencies in the UK, USA, and Europe, which feared it would reduce or limit competition in areas like data center. Nvidia indicated it would continue working with Arm, and it will retain a 20-year Arm license. (SoftBank will retain the $1.25 billion prepaid by Nvidia.) SoftBank said it wil... » read more

Blog Review: Feb. 9


Arm's Mark Inskip walks through how the Morello program built a demonstration of the architecture that enables fine-grained memory protection and highly scalable software compartmentalization based on the CHERI (Capability Hardware Enhanced RISC Instructions) architectural model, from IP development and SoC design to creating software and a demonstration board. Synopsys' Plamen Asenov and su... » read more

Power/Performance Bits: Feb. 7


Stopping interference in integrated photonics Researchers at EPFL and Purdue University combined integrated photonics and MEMS to develop an electrically driven optical isolator-on-a-chip that transmits light in only one direction. Optical isolators are useful to prevent reflected light from other components compromising or interfering with an on-chip laser’s performance. They are often c... » read more

Week In Review: Design, Low Power


Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

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