Author's Latest Posts

Chiplet Architecture: Scalable and Cost-Efficient Systems for Irregular Applications (Princeton)
By Technical Paper Link - 30 Nov, 2023 - Comments: 0

A new technical paper titled "DCRA: A Distributed Chiplet-based Reconfigurable Architecture for Irregular Applications" was published by researchers at Princeton University. Abstract "In recent years, the growing demand to process large graphs and sparse datasets has led to increased research efforts to develop hardware- and software-based architectural solutions to accelerate them. While... » read more

Alleviating the DRAM Capacity Bottleneck in Consumer Devices with NVMs
By Technical Paper Link - 30 Nov, 2023 - Comments: 0

A new technical paper titled "Extending Memory Capacity in Modern Consumer Systems With Emerging Non-Volatile Memory: Experimental Analysis and Characterization Using the Intel Optane SSD" was published by researchers at ETH Zurich, University of Illinois Urbana-Champaign, Google, and Rivos. Abstract Excerpt "DRAM scalability is becoming a limiting factor to the available memory capacity in... » read more

Chiplets For Generative AI Workloads: Challenges in both HW and SW
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets" was published by researchers at University of Pittsburgh, Lightelligence, and Meta. Abstract "Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous c... » read more

Diamond Semiconductor: Highest Breakdown Voltage, Lowest Leakage Current
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A technical paper titled "Diamond p-Type Lateral Schottky Barrier Diodes With High Breakdown Voltage (4612 V at 0.01 mA/Mm)" was published by researchers at University of Illinois at Urbana–Champaign. Abstract "Diamond p-type lateral Schottky barrier diodes (SBDs) with a 2- μm -thick drift layer are fabricated with and without Al2O3 field plates. Schottky contacts composed of Mo (50 nm) ... » read more

Engineering chirality at wafer scale with ordered CNT architecture (Rice University and others)
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Engineering chirality at wafer scale with ordered carbon nanotube architectures" was published by researchers at Rice University, University of Utah, J.A. Woollam Co. and Tokyo Metropolitan University. Abstract "Creating artificial matter with controllable chirality in a simple and scalable manner brings new opportunities to diverse areas. Here we show two su... » read more

Secure NFC-Based Wireless Battery Management System
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Wireless BMS Architecture for Secure Readout in Vehicle and Second life Applications" was published by researchers at TU Graz and NXP. Abstract "Battery management systems (BMS) are becoming increasingly important in the modern age, where clean energy awareness is getting more prominent. They are responsible for controlling large battery packs in modern elect... » read more

Front-end patterning and epitaxy approach on Si photonics 220nm SOI substrates
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Lateral Tunnel Epitaxy of GaAs in Lithographically Defined Cavities on 220 nm Silicon-on-Insulator" was published by researchers at Cardiff University and University of Southampton. Abstract "Current heterogeneous Si photonics usually bond III–V wafers/dies on a silicon-on-insulator (SOI) substrate in a back-end process, whereas monolithic integration by di... » read more

A Fast And Unified Toolchain For Rapid Design Space Exploration Of Chiplet Architectures
By Technical Paper Link - 27 Nov, 2023 - Comments: 0

A technical paper titled “RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures” was published by researchers at ETH Zurich and University of Bologna. Abstract: "Chiplet architectures are a promising paradigm to overcome the scaling challenges of monolithic chips. Chiplets offer heterogeneity, modularity, and cost-effectiveness. The design space of chiplet ... » read more

Free Space Optical Quantum Key Distribution (FSO-QKD) System Within a Vehicle-to-Infrastructure Application
By Technical Paper Link - 27 Nov, 2023 - Comments: 0

A new technical paper titled "A Practical Implementation of Quantum-Derived Keys for Secure Vehicle-to-Infrastructure Communications" was published by University of Warwick. Abstract "We provide a practical implementation of a free space optical quantum key distribution (FSO-QKD) system within a vehicle-to-infrastructure (V2I) application developed under the Innovate UK AirQKD project. The ... » read more

Lateral 3 kV AlN SBDs on Bulk AlN Substrates By MOCVD
By Technical Paper Link - 27 Nov, 2023 - Comments: 0

A new technical paper titled "3 kV AlN Schottky Barrier Diodes on Bulk AlN Substrates by MOCVD" was published by researchers at Arizona State University. Abstract "This letter reports the first demonstration of AlN Schottky diodes on bulk AlN substrates by metalorganic chemical vapor phase deposition (MOCVD) with breakdown voltages exceeding 3 kV. The devices exhibited good rectifying char... » read more

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