Author's Latest Posts


Verifying Security Aspects Of SoC Designs


This paper presents Jasper technology and methodology to verify the robustness of secure data access and the absence of functional paths touching secure areas of a design. Recently, we have seen an increasing demand in industrial hardware design to verify security information. Complex system-on-chips, such as those for cell phones, game consoles, and servers contain secure information. And it i... » read more

The Rise Of Semiconductor IP Subsystems


The semiconductor IP (SIP) market arose when SIP vendors created IP functions that mirrored those found in the discrete semiconductor market and made those functions available to SoC designers in the form of hard or soft SIP blocks. As the SoC and SIP markets evolved, it was a natural evolution that many discrete SIP functions be converged into larger blocks that mimic system-level functions (i... » read more

FPGA Verification with Assertions: Why Bother?


This paper provides a practical, easy, step-by- step set of instructions on how to add assertions to your RTL design. By following the simple guidelines provided in this paper you will benefit by cutting simulation debugging time in half, as well as finding very complex bugs that are likely to escape traditional simulation without assertions. To download this white paper, click here. » read more

Unifying Hardware-Assisted Verification And Validation Using UVM And Emulation


Successful approaches to improve verification productivity are to increase the speed of verification and begin validating software/hardware integration very early in the design process. Historically, verification and validation platforms have been developed as separate flows, preventing reuse of modules and methods between the two. As a consequence, various customized verification and validatio... » read more

Strategies To Prevent IC Failures In Volume Production


When IC devices are produced and shipped to end customers, it is important that they will function as specified in the application environment. This paper outlines strategies and practices used to statistically sample, and predict how a device will operate over time. The practices outlined are believed to be best in class techniques for a successful product launch. These strategies most likely ... » read more

DFTMAX Compression Shared I/O


A significant design trend in recent years has been the widespread use of ARM multicore processors in systems-on-chip (SoCs). Designers’ ability to easily and cost-effectively employ multiple, high-performance embedded processors to meet the computational demands of the end application has helped fuel the explosive growth in mobile computing, networking infrastructure, and digital infotainmen... » read more

Strategies To Prevent IC Failures In Volume Production


When IC devices are produced and shipped to end customers, it is important that they will function as specified in the application environment. This paper outlines strategies and practices used to statistically sample, and predict how a device will operate over time. The practices outlined are believed to be best in class techniques for a successful product launch. These strategies most likely ... » read more

DFTMAX Compression Shared I/O


A significant design trend in recent years has been the widespread use of ARM multicore processors in systems-on-chip (SoCs). Designers’ ability to easily and cost-effectively employ multiple, high-performance embedded processors to meet the computational demands of the end application has helped fuel the explosive growth in mobile computing, networking infrastructure, and digital infotainmen... » read more

Unifying Hardware-Assisted Verification And Validation Using UVM And Emulation


Successful approaches to improve verification productivity are to increase the speed of verification and begin validating software/hardware integration very early in the design process. Historically, verification and validation platforms have been developed as separate flows, preventing reuse of modules and methods between the two. As a consequence, various customized verification and validatio... » read more

GloFo Says 28nm FD-SOI Die Cost Much Less Than 28nm Bulk HPP


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ According to Shigeru Shimauchi, Country Manager, GlobalFoundries Japan, for the same level of performance, the die cost for 28nm FD-SOI will be substantially less than for 28nm bulk HPP (“high performance-plus”). Specifically, to get a 30%  increase in performance over 28nm bulk LPS PolySiON, HPP increases die ... » read more

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