Heterogeneous integration and new materials are driving fundamental changes in workhorse tools.
Optical inspection always has been the workhorse technology for finding defects in chips. It’s fast, cost-efficient, and generally reliable enough for most chips. But as logic scales into the angstrom range, and as systems become collections of chiplets, optical inspection needs to be combined with other types of inspection such as X-ray and acoustic. Kyle Vander Schaaf, application engineer at Nordson Test & Inspection, talks about new challenges in inspection, including reflection in glass substrates, shadowing from chiplets of different heights, and how inspection data is being conflated with other data using slower but deeper inspection tools and analyzed using AI.
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