Blog Review: Feb. 26

Got enough time for verification? How about a verification conference? In preparation for DVCon, Real Intent’s Graham Bell grills a panel of experts on where design ends and verification begins. The answer: It depends.

Mentor’s Dennis Brophy points to the new version of the Universal Verification Methodology as a reason to attend DVCon next week. Even if you don’t plan to attend, there’s a tutorial.

Also in preparation for DVCon, Synopsys’ Karen Bartleson interviews Stan Krolikoski, general chair of DVCon, and Ambar Sarkar, technical program committee chair. Got coverage?

Cadence’s Brian Fuller plays travel guide in Barcelona at the Mobile World Congress through a series of videos. This is like watching the good and bad of international trade shows without jet lag.

ARM’s Karthik Ranjan has hit on a plan by Lufthansa to provide in-flight entertainment on your device of choice. Is this a good thing or a bad thing?

Mentor’s Anil Khanna shows how to debug performance issues in a Qt 5.x application. Part one can be found here.

Synopsys’ Mick Posner has discovered the good part about international travel—especially in Ireland. There’s some information about integrating IP, too, between sips.

Cadence’s Moshik Ruben takes to the white board to talk about all the MIPI protocols, what’s changing, and why they’re so important.

ARM’s Lori Kate Smith has three videos about the company shipping 50 billion chips. That’s about 8 ARM chips for every person on the planet.

And in cased you missed last week’s Manufacturing, Design & Test newsletter, here are some noteworthy blogs:

Mark LaPedus observes there are two chip scaling paths emerging, one aggressive and the other cost-sensitive.

Mentor Graphics’ Linda Prowse Fosler asks what it takes for companies to look for new verification methods and tools.

Semico Research’s Jim Feldhan notes that the push toward mobility and the need for more memory per system are creating new rules for DRAM.

Patterning guru Michael Watts points to what he considers a milestone in imprint lithography, where Canon bought the semiconductor arm of Molecular Imprints.

Applied Materials’ Ehud Tzuri looks at the shift from lithography-enabled 2D devices to materials-enabled 3D devices.

And SEMI’s Karen Savala observes a consistent theme — the challenge of building an innovative workforce with fresh ideas.