Blog Review: June 13

Patching the IoT; getting to 3nm; photonics verification; embedded on the edge.


Synopsys’ Taylor Armerding looks at what the flaws in OpenPGP and S/MIME encryption means for the IoT and warns that the problems of patching such devices could lead to an increasing chance of security failures.

Cadence’s Paul McLellan takes a peek at Imec’s roadmap to see what the path to 3nm looks like, how nanosheets fit in, and why design and system technology co-optimization is necessary going forward.

Mentor’s Omar El-Sewefy argues that while photonics circuit verification is a challenging prospect, existing tools are rapidly expanding scope to address it.

UltraSoC’s Andy Gothard considers the factors bringing verification and validation closer together and why prototyping and emulation struggle to address some of the complex problems in big SoCs.

SEMI’s Debra Vogler gets insights on the most important scaling trends, with both Imec and IBM agreeing that a new device architecture beyond finFET is required to reach 3nm.

Intel’s Ron Wilson argues that while embedded computing has weathered many technology shifts, the rise of edge computing means new challenges, from a much greater number of connections to managing partitioning problems.

Applied Materials’ Sundeep Bajikar explains integrated materials systems, an approach for combining multiple materials to form novel structures with precise electrical properties, and why it’s needed for new devices.

Arm’s Chris Adeniyi-Jones shares highlights from the recent Computing Frontiers conference, from augmenting a VLIW processor for fault tolerance to possibilities in Post-Moore Computing.

Lam Research’s Shelly Miyasato introduces the Industrial IoT and why the addition of widespread sensing and data analysis in smart factories will lead to a fourth industrial revolution.

Rambus’ Aharon Etengoff notes that as interest in Industrie 4.0 grows, more organizations and companies are focusing on using distributed ledgers as a way to secure data in the Industrial IoT.

ANSYS Warsaw University of Technology student Tomasz Kublin explains how his team used simulation to help design the electromagnetic braking system for a Hyperloop test pod.

NXP’s Jean-Philippe Meunier takes a look at fail-safe architectures and how greater vehicle autonomy is requiring a shift to fail-operational systems that guarantee the full or degraded operation even if a failure occurs.

Samsung’s Bita Sistani argues that for autonomous vehicles to become a major feature of the road, 5G wireless technology must be widely deployed.

For more good reading, check out the blogs featured in the latest IoT, Security & Automotive and Packaging, Test & Materials newsletters:

Editor in Chief Ed Sperling contends that while Level 3 cars are definitely coming, don’t expect Level 4 or 5 vehicles anytime soon.

Achronix’s Alok Sanghavi points to why you need a programmable fabric in an ASIC or SoC.

Flex Logix’s Geoff Tate examines the key considerations for the ideal embedded FPGA implementation.

ClioSoft’s Ranjit Adhikary argues that to get the maximum value from IP assets requires a change in how we manage them.

Synopsys’ Robert Vamosi observes that the amount of software in cars is growing rapidly, bringing both risks and opportunities.

Marvell’s Avinash Ghirnikar explains why the upcoming WiFi 802.11ax standard is essential for dealing with zettabytes of sensor data in connected vehicles.

Mentor’s Chris Cone looks at what’s required from design tools for the new wave of photonic circuits.

Editor In Chief Ed Sperling contends that confusion about what comes next in chip scaling is not a good thing.

Technology Editor Jeff Dorsch points to VLSI Research’s list of test vendors.

Brewer Science’s Kim Yess explains what’s necessary to enable continued scaling and 3D integration.

Advantest’s Judy Davies questions whether advances in prosthetics will give athletes an unfair advantage.

Rambus’ Paul Karazuba considers the different security strategies for different companies and markets.

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