Comparative Stochastic Process Variation Bands For N7, N5, And N3 At EUV


By Alessandro Vaglio Preta, Trey Gravesa, David Blankenshipa, Kunlun Baib, Stewart Robertsona, Peter De Bisschopc, John J. Biaforea a) KLA-Tencor Corporation, Austin, TX 78759, U.S.A. b) KLA-Tencor Corporation, Milpitas, CA 95035, U.S.A. c) IMEC, Kapeldreef 75, 3000, BE ABSTRACT Stochastics effects are the ultimate limiter of optical lithography technology and are a major concern for n... » read more

Unsticking Moore’s Law


Sanjay Natarajan, corporate vice president at Applied Materials with responsibility for transistor, interconnect and memory solutions, sat down with Semiconductor Engineering to talk about variation, Moore's Law, the impact of new materials such as cobalt, and different memory architectures and approaches. What follows are excerpts of that conversation. SE: Reliability is becoming more of an... » read more

Low Power At The Edge


The tech world has come to the realization in recent months that there is far too much data to process everything in the cloud. Now it is starting to come to grips with what that really means for edge and near-edge computing. There still are no rules for where or how that data will be parsed, but there is a growing recognition that some level of pre-processing will be necessary, and that in tur... » read more

Boosting Analog Reliability


Aveek Sarkar, vice president of Synopsys’ Custom Compiler Group, talks about challenges with complex design rules, rigid design methodologies, and the gap between pre-layout and post-layout simulation at finFET nodes. https://youtu.be/JRYlYJ31LLw » read more

Thermal Guard-Banding


Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm. https://youtu.be/VnX-TiaMVmI » read more

What’s the Right Path For Scaling?


The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Top Tech Talks Of 2018


2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Top Stories For 2018


Each year, I look back to see what articles people like to read. The first thing that has amazed me each year at Semiconductor Engineering is that what should be a strong bias towards articles published early in the year never seems to play out. The same is true this year. More than half of the top articles were published after July. The second thing that remains constant is that people love... » read more

Will AI Drive Scaling Forward?


The almost ubiquitous rollout of AI and its offshoots—machine learning, deep learning, neural nets of all types—will require significantly more processing power as the amount of data that needs to be processed continues to grow by orders of magnitude. What isn't clear yet is how that will affect semiconductor manufacturing or how quickly that might happen. AI is more than the latest buz... » read more

2 Big Shifts, Lots Of Questions


The proliferation of AI everywhere, and ongoing efforts by big systems companies to develop their own chips, could have a profound effect on semiconductor manufacturing for years to come. AI is a multi-faceted topic, but what makes this particularly interesting from a semiconductor standpoint is the architecture of AI-specific chips. So far, most of these chips have been developed for data c... » read more

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