Blog Review: June 26

Arm’s Krish Nathella and Dam Sunwoo dig into research to make a practical implementation of a temporal data prefetcher that overcomes the huge on- and off-chip storage and traffic overheads usually associated with them.

Cadence’s Paul McLellan notes that while concerns about uncover bias in computer vision algorithms usually focus on people, a team at Facebook found that object recognition tasks frequently misidentify common household items in Africa and Asia.

Synopsys’ Taylor Armerding points to the importance of securing your supply chain in the latest major data breach of personal and medical information held by medical testing companies, which affected nearly 20 million people and was due to a collection agency.

Mentor’s Colin Walls considers whether C and C++ should be mixed in embedded applications, ways they can coexist, and how to treat legacy code.

A Rambus writer takes a look at the development of NOVA, a file system designed to maximize performance on hybrid memory systems, and Ziggurat, an NVM optimization tool

ANSYS’ Paolo Colombo checks out what consumers think of autonomous aircraft in a recent survey that looked at how soon respondents would be willing to fly in one and their biggest safety concerns.

A team at Karlsruhe Institute of Technology argues that multiple-user FPGAs in data centers are vulnerable to side-channel attacks and restrictions should be put on immediate access to filter out malicious users.

NI’s Daniel Riedelbauch shares highlights from the Automotive Testing Expo, including sensor fusion system testing, batteries for electric vehicles, and test data management.

Walt Custer of Custer Consulting points to recent forecasts for key sectors of the global electronic supply chain and says that while there are indications of an upturn ahead, most will likely struggle at least though autumn.

Plus, check out the blogs featured in last week’s Manufacturing, Packaging & Materials newsletter:

Editor In Chief Ed Sperling finds consensus that semiconductors that can last for many years, but challenges in how to spread out the cost.

Editor Mark LaPedus looks at the latest IC forecasts amid the U.S.-China trade war.

Brewer Science’s Shelly Fowler explains process factors that come into play when considering the best bonding/debonding approach for fan-out wafer-level packaging.

Applied Materials’ Sean SK Kang stresses the importance of moving MRAM and PCRAM into volume production.

Semico Research’s Jim Feldhan predicts long-term growth for automotive semiconductor sales, despite the current slowdown.

SEMI’s Jay Chittooran warns that U.S. and Chinese retaliatory tariffs will stifle innovation and cost SEMI members nearly $800 million in annual duties.

And read an interview with Telle Whitney, recipient of the 2019 IEEE Honorary Membership, on the role of women in the semiconductor industry.