Blog Review: June 27

Why AI needs new architectures; formal abstractions; buying IP; 20 years of copper.

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Applied Materials’ Sundeep Bajikar argues that to realize the full potential of AI, new computing architectures are necessary, otherwise AI will quickly become unaffordable.

Synopsys’ Iain Singleton considers why it may not always be necessary to start at the reset state during formal verification and how to use abstractions to get a head start on bug hunting.

Cadence’s Meera Collier looks why it’s become so common to purchase interface IP rather than making it within the company and important things to consider when choosing a vendor.

Mentor’s Colin Walls shares another set of embedded software tips, including optimizing C code, accessing hardware ports in C/C++, and breaking down code for readability.

Lam Research’s Shelly Miyasato looks back on twenty years of copper interconnects, why it’s been one of the most significant inflections the industry has ever seen, and what it took to successfully integrate copper.

Walt Custer of Custer Consulting Group digs into what the larger worldwide GDP expectations means for the semiconductor industry, plus the recently released semiconductor sales predictions from WSTS.

Arm’s Jim Wallace and Cadence’s Kevin Yee explain CCIX, the effort to allow accelerators from different suppliers to interoperate with each other, and the 7nm test chip the companies created along with Xilinx and TSMC.

Writing for GlobalFoundries, Gary Dagastine looks at what technologies will be needed to enable autonomous cars and how to handle the massive amounts of data they’re projected to produce.

Ansys’ Mark Ravenstahl point to the importance of millimeter-wave radar for ADAS and autonomous vehicles and the challenges of radar simulation.

NXP’s Martijn van der Linden checks out a project from the Technical University of Eindhoven that aims to train a lifeguard drone to detect and assist swimmers who may be in trouble in pool environments.

And don’t forget to check out the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling contends that the next big breakthroughs in performance will come from completely different approaches.

Executive Editor Mark LaPedus talks with Imec’s CEO about artificial intelligence, automotive, EUV and DNA storage.

Lam Research’s Alex Yoon examines new approaches for cloud computing and mobile applications.

GlobalFoundries’ Yafeng Zhang looks at whether system-in-package or eNVM is better for microcontrollers and why.

Applied Materials’ Sundeep Bajikar explains why a radical new use in materials and 3D techniques requires changes in process equipment strategies.

Semico Research’s Rich Wawrzyniak argues that for advanced SoCs, the projected time and cost saving could make artificial intelligence a must-have item in EDA tools.

SEMI pulled together experts from leading companies to determine what data is relevant, and how to use it as a differentiator in smart manufacturing.

Coventor’s Benjamin Vincent details how to identify design interaction issues and ensure process control and uniformity.



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