Blog Review: Oct. 18

Signal integrity issues; formal core data; mobile display trends; UN eyes blockchain; area-selective deposition.

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Mentor’s Nitin Bhagwath suggests some ways to deal with undesirable signal integrity effects in DDR designs.

Cadence’s Ken Willis argues that for multi-gigabit serial link interfaces, signal integrity analysis should start upstream of the traditional post-layout verification step.

Synopsys’ Ravindra Aneja contends that understanding formal core data can reduce the overall effort and shorten the convergence time in formal projects.

ARM’s Hellen Norman looks at an array of trends in mobile displays, from high dynamic range to multi-window display.

Rambus’ Aharon Etengoff notes the UN is eyeing blockchain technology as a way to make cross-border payments easier.

Research blogger Bart Macco explains a new approach to area-selective atomic layer deposition.

Marvell’s Aviad Enav Zagha argues that it’s time to migrate a portion of network processing to the enterprise edge.

A Lam Research writer points to several ways classrooms are broadening students’ access to technology.

GlobalFoundries’ Dave Lammers explains the company’s push into the automotive space.

Synopsys’ Eric Huang warns that not all USB Type-C ports are equal when it comes to headphones.

Mentor’s Andrew Macleod dives into test technologies to get automotive ICs to zero defects.

Cadence’s Paul McLellan checks out why what happens in China has huge impacts on the entire semiconductor industry.

In a video, Mentor’s Colin Walls takes a look at event flags as one of the simplest inter-task communication and synchronization facilities for RTOS.

In a video, Cadence’s Scott Jacobson examines the market size of the automotive electronics industry and how it drives new requirements for memory models.

And don’t miss the blogs highlighted in last week’s Low Power-High Performance newsletter:

Editor In Chief Ed Sperling contends that allowing high-performance devices to operate in extreme temperatures could have big impacts for semiconductors across a wide variety of markets.

Executive Editor Ann Steffora Mutschler observes that the growth of public clouds will open many new opportunities in the semiconductor industry.

Mentor’s Flint Yoder explains how to tune a circuit’s behavior to meet both power and performance specifications.

Helic’s Magdy Abadir zeroes in on the impact of faster speeds and smaller features on noise.

Cadence’s Rob Knoth finds that as test grows in importance, earlier integration is key.

Rambus’ Victor Cai looks at the evolution of memory buffer chips, including lower prices and higher shipments.

Synopsys’ Rich Collins points out that embedded devices are becoming lucrative targets for attackers.

Ansys’ Annapoorna Krishnaswamy details the signoff requirements for next-gen automotive electronics.