tag: signal integrity

Clocked DDR5 Client Memory Modules Enable Scaling To 9600 MT/s For AI PCs
By Carlos Weissenberg - 11 Jun, 2026 - Comments: 0

AI PCs are driving a new class of client workloads that behave very differently from traditional productivity or multimedia applications. Agentic AI systems are expected to plan, execute, and adapt in real time, maintaining persistent context while orchestrating multiple concurrent tasks. These usage patterns place sustained pressure on the memory subsystem, requiring not only higher peak bandw... » read more

Unlocking High-Speed Serial Link Signal Integrity With AMI Model
By Priyadarshini N D - 30 Apr, 2026 - Comments: 0

As the demand for faster data rates in high-speed interfaces such as PCIe, USB, and DDR continues to escalate, maintaining signal integrity has become a significant challenge for engineers. Traditional SPICE-based simulations, while precise, often suffer from computational intensity, making it impractical to model the intricate behavior of high-speed signals across millions of bits. This is ... » read more

Solving Clock Signal Integrity And Jitter Issues
By Manoz Palaparthi - 30 Apr, 2026 - Comments: 0

A recent blog post discussed the challenges of clock signal integrity and clock jitter in deep submicron semiconductor devices. Nice, clean clock signals are degraded due to many factors, including noise in the power delivery network (PDN). Timing variation due to clock jitter is also a serious issue, especially for chips operating at low voltage with high frequencies. The impact due to cloc... » read more

What’s Failing At The Interface
By Gregory Haley - 07 Apr, 2026 - Comments: 0

Key Takeaways The interface is where failures in advanced packaging become visible, but it's increasingly not where they originate. Weak interfaces often don't fail at time zero, but they do degrade due to parametric drift and margin erosion that binary test screens miss entirely. The temporary test interconnect is the largest variable in the measurement chain and must be controlled ... » read more

The Design Challenges Of Clock Integrity And Clock Jitter
By Manoz Palaparthi - 15 Jan, 2026 - Comments: 0

Signal integrity is one of the many challenges faced by chip designers. Deep submicron technologies are unfriendly hosts for the nice, clean signals desired. The culprits that compromise signal integrity and introduce jitter include thermal effects, manufacturing flaws, signal crosstalk, IR (voltage) drop, signal loss over long runs, reflections, electromagnetic interference (EMI), ground bounc... » read more

Tracking Your Preferences
By Brian Bailey - 23 Dec, 2025 - Comments: 0

I like to use my last blog of the year to focus on you, the reader. You provide valuable feedback to me and the rest of the team at Semiconductor Engineering. What do you want to see us write about? How in-depth should things be? This is always a balance between the amount of information provided and the rate at which readers tire with an article. My focus is the channels I write for – Sys... » read more

Designing for 448G: Modulation, DSP, and Channel Trade-offs in High-Speed SerDes
By Synopsys - 10 Dec, 2025 - Comments: 0

Discover practical solutions and engineering insights for deploying 448G SerDes in AI and HPC cluster networks. In this white paper, you’ll learn: The impact of retimed vs. unretimed host architectures on signal integrity and power Key trade-offs between PAM4 and PAM6 modulation Channel design simulations and DSP implications using real-world 448G topologies Equalization stra... » read more

Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)
By Technical Paper Link - 25 Nov, 2025 - Comments: 0

A new technical paper titled "Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity" was published by researchers at Arizona State University and University of Minnesota. Abstract: "The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction... » read more

Noise: A Chip Killer
By Brian Bailey - 13 Nov, 2025 - Comments: 0

Noise has always been important to communications experts, but it's quickly becoming an issue that every semiconductor designer has to contend with. Some chips already have been compromised. Noise can be defined as any deviation from the ideal that can impact intended functionality. When it comes to semiconductors, that could mean the ability to reliably extract a signal value at the intende... » read more

Combining SPICE With IBIS-AMI: Solving Advanced Signal Integrity Verification Challenges With Solido SPICE
By Siemens EDA - 06 Nov, 2025 - Comments: 0

This paper explores current technology trends in high-speed links, including high-speed memory and SerDes applications, highlighting the critical roles of combined SPICE-level and IBIS-AMI modeling for accurate verification. Verifying high-speed links with IBIS-AMI during the circuit design phase presents significant complexity due to the combined effects of equalization schemes, channel S-para... » read more

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