Blog Review: Oct. 25

Formal and faults; driving Moore’s Law; RSA flaw; SSD interface; autos.


Mentor’s Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification.

Cadence’s Paul McLellan listens in as AMD’s Mark Papermaster discusses what’s needed to keep driving Moore’s Law.

Synopsys’ Jesse Victors takes a look at ROCA, the latest flaw affecting RSA cryptography, and argues it may be time for a new encryption scheme.

Marvell’s Jeroen Dorgelo argues that SSD speeds have been bottlenecked by legacy interfaces, and why NVMe better addresses the needs of flash storage.

Rambus’ Aharon Etengoff argues that for autonomous cars to be adopted, security must be integrated at the earliest stages of product development.

Arm’s James De Vile checks out the connected car market, and says the auto industry is not adopting IoT at the same rate as other sectors.

Intel’s Ron Wilson takes a look at the biggest topics at this year’s Hot Chips conference, from multicore and data parallelism to the latest server chips.

GlobalFoundries’ Dave Eggleston says embedded MRAM is poised to make a big splash in the memory world, and commercialization is just around the corner.

Applied’s Kerry Cunningham examines several of the challenges facing development of displays for VR technologies.

Ansys’ Marc Horner shows how multi-domain simulation can help development of a complex system like a wearable insulin pump.

Sondrel’s Samuel Kong shares some of the latest computer vision research from this year’s British Machine Vision Conference, from creating 3D models to lip reading.

In a video, Cadence’s Scott Jacobson discusses why the requirements are changing for automotive memory models.

Mentor’s Nitin Bhagwath continues his series on DDR design with a look at receiver requirements at both the controller and the DRAM.

And don’t miss the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling argues that technology’s future will be defined by people shortages, trade imbalances and a very large market opportunity.

Executive Editor Mark LaPedus interviews UC Berkeley’s Tsu-Jae King Liu about implant lithography, reconfigurable wires and almost gate-all-around.

Applied Materials’ Adam Ge and Shimon Levi examine new overlay options for faster throughput.

SEMI’s Paula Doe finds that new technologies and different ways of integrating more intelligence are generating new opportunities in the MEMS market.

Lam Research’s Aaron Eppler observes that the last frontier for improving yield is the outer 10mm.

Coventor’s Michael Hargrove investigates three different air gap process flows and the resulting capacitance reduction.

Arm’s Rob Aitken considers whether there will be enough resources and designers to build a trillion connected things.

Semico’s Joanne Itow tracks where the microcontrollers are going.

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