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Blog Review: Oct. 27

UVM and Python; export regulations in EDA; HBM3 features; tech in healthcare.

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Siemens EDA’s Ray Salemi continues looking into using Python for verification by looking at how pyuvm simplifies and refactors the UVM TLM system to take advantage of the fact that Python has multiple inheritance and no typing.

Cadence’s Paul McLellan listens in as Larry Disenhof explains the impact that export regulations have on EDA tools and IP products and changes in a rapidly shifting landscape, including how tools are categorized.

A Synopsys writer points out key differentiating features in HBM3, including a pseudo channel mode architecture, a dual clocking architecture, and provision for on chip ECC calculation.

In a podcast, Arm’s Geof Wheelwright and Rob Aitken chat with Matthew Griffin of 311 Institute about the impact tech and AI could have on the healthcare industry in the next 10 to 20 years, including the opportunities for hospitals and the key ethical and security concerns that may arise.

In a blog for SEMI, Ansys’ John Lee argues for the value of multiphysics simulation and multivariate analysis in 3D-IC design to assess the risks for high-frequency signal failure, reliability, and other performance issues such as thermal buildup.

Western Digital’s Ronni Shendar considers how to handle the massive amounts of data that satellites are collecting and sending back to Earth and the insights that can be gained from analyzing it.

Rambus chats with Shane Rau of IDC about why the time between generations of main memory is getting longer and the interplay between capacity, bandwidth, and latency.

And don’t miss the blogs highlighted in last week’s Manufacturing, Packaging & Materials newsletter:

Executive Editor Mark LaPedus zeroes in on a key technology in lithography.

Amkor’s Yongjai Seo shows how to pack several functions into a single SiP without interference.

eBeam Initiative’s Jan Willis looks at which design layout target shapes will result in the best performance with the smallest footprint.

Coventor’s Yu De Chen explains how to use virtual fabrication to study profile variation in a 5nm finFET.

SEMI’s Kim Sin observes that China’s semiconductor sector is rapidly becoming one of the largest in the world.

TechInsight’s Stacy Wegner, Daniel Yang, and Ziad Shukry dissect a major consumer device.

Brewer Science’s Jessica Albright points to the most common applications of periodic condition monitoring.

Onto’s Prasad Bachiraju recommends pre-classifying defects and binning defective dies during inspection to meet reliability requirements.



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