Blog Review: October 11

Cadence’s Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination.

Synopsys’ Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators.

Siemens’ Kevin Webb explains the basics of design for manufacturing (DFM) and design for assembly (DFA) and why it’s more cost effective to design quality and efficient manufacturing practices into the product from its inception.

Arm’s Andrew Jones argues that the automotive industry is going through its biggest transformation since the commercial production of cars began with the emergence of software-defined vehicles, but this also brings a larger attack surface requiring more robust cybersecurity.

The ESD Alliance’s Bob Smith chats with Jay Vleeschhouwer of Griffin Securities about drivers behind EDA industry growth, revenue models, and the convergence of engineering software and EDA.

Ansys’ Kate Osborne looks at the risks associated with per- and polyfluoroalkyl substances (PFAS) as regulations on them increase and the efforts by companies to reduce their use or replace them in products.

Codasip’s Laurent Arditi introduces some best practices to apply when starting formal verification on a component, including investing in a generic formal framework and not rushing to add assertions.

Keysight’s Nick Hudson suggests that getting the automotive human machine interface (HMI) experience right holds the key to taking the lead in the new era of software-defined vehicles, with testing playing a key role.

Renesas’ Lv Shaosong presents a deep learning PCB defect detection solution using YOLOv3-tiny, a lightweight object detection algorithm.

And don’t miss the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Siemens EDA’s Wilfried Wessel and Florian Bauer, along with Simon Liebetegger of the University of Applied Sciences at Darmstadt, propose a foundation for holistic design and verification for power modules that uses S-Parameter compliance checks.

Rambus’ Maxim Demchenko looks at protecting communications between zonal gateways.

Infineon’s Francesco Di Domenico unfurls 10 factors needed to understand and manage parasitic inductance in power electronics.

Renesas’ Masaki Hama lays out ways to ensure that even if IoT device key data is replicated, it can’t be decrypted.

MITRE’s Laurie Giandomenico encourages computer science students to focus on embedded cybersecurity.

Flex Logix’s Cheng Wang emphasizes the importance of verifying all the connections between the SoC and the eFPGA.

Synopsys’ Ron DiGuiseppe and Hezi Saar explain why microcontrollers with parallel processing capabilities are central to bringing AI into vehicle subsystems.

Cadence’s Suhas Mitra describes a common software interface and tooling across all market verticals.

Onto Innovation’s Johnny Dai, Cheolkyu Kim, and Priya Mukundhan look at the most promising power semiconductor devices for future use cases such as electric vehicles.

NI’s Marcus daSilva explains why integrating AI directly into the physical layer can create issues that need to be carefully addressed.

Advantest’s Vijayakumar Thangamariappan evaluates three types of object-detection algorithms to improve the inspection process.

Synopsys’ Pawini Mahajan digs into the advantages of predictive maintenance in the auto industry, including using advanced monitoring and analytical techniques as a part of silicon lifecycle management.

Teradyne’s Eli Roth shows how integrating data analytics and AI/ML into semiconductor manufacturing processes will help to keep up with the expected pace of the market.

Bruker’s Inga Koehler describes which Raman and FTIR filters are available and how to select the right one for your needs.

DR Yield’s Dieter Rathei explains why installing a yield management system ahead of the critical yield ramp up phase can pay for itself.