Blog Review: Sept. 21

FP8 for AI; very short-reach connectivity; hot chiplets; medical device requirements.


Arm’s Neil Burgess and Sangwon Ha explain why they’ve joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum.

Synopsys’ Manuel Mota examines very short-reach (VSR) connectivity, including trends that are driving a transformation in the data center, specific use cases, and overcoming existing reach limits of copper modules.

Cadence’s Paul McLellan shares highlights from the recent Hot Chips, with a focus on some of the latest technologies for putting more than one die in a package.

Siemens’ Scot Morrison looks back at the history of the FDA and the role it could play in the future of requirements placed on medical device manufacturers, particularly where software is concerned.

Rambus’ Philippe Legros explains how Single Root I/O Virtualization (SR-IOV) can make it easier to implement virtualization within PCIe systems by enabling multiple virtual machines to share PCI hardware resources in a cost-effective way.

Renesas’ Riccardo Vincelli provides a basic introduction to the evolution of some of the functional safety standards for automotive products, including how and why they have been introduced.

Ansys’ Susan Coleman checks out how metamaterials can enable manufacturers to incorporate various physical functions such as vibration, acoustics, heat conduction, deformation, and weight reduction into their products.

The ESD Alliance’s Bob Smith chats with Ying Chen of S2C about trends in the FPGA prototyping market, including sift left and the use of AI/ML for partitioning.

Plus, check out the latest blogs, including from the Manufacturing, Packaging & Materials newsletter:

Amkor’s Nathan Whitchurch looks at the unique challenges of complex packages and why they require high simulation fidelity to characterize performance.

SEMI’s Serena Brischetto interviews TEL’s Eyal Shekel about how materials informatics enabled by AI can guide optimization of production processes.

Cadence’s Anika Sunda explains how to bring intelligence into the regression space to increase verification efficiency.

Synopsys’ Brad Bailey looks at how to ensure the confidentiality and integrity of SoCs during design and manufacturing.

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